Flux composition and solder composition

A composition and flux technology, applied in the field of flux compositions and solder compositions, can solve the problems of discoloration of the flux, the meltability of the solder composition may not be sufficient, etc., to prevent the discoloration of copper foil, and to achieve excellent solder coating expansion. , the effect of excellent solder melting

Active Publication Date: 2014-10-01
TAMURA KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, it has been found that when soldering is performed using the solder compositions described in Documents 1 and 2, there is a problem of discoloration of the copper foil after soldering and the porti

Method used

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  • Flux composition and solder composition
  • Flux composition and solder composition

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0070] [Example 1]

[0071] The rosin resin A43% by mass, the rosin resin B6% by mass, the organic acid A3.5% by mass, the iodine carboxyl compound A0.2% by mass, the antioxidant 2% by mass, the thixotropic agent A4% by mass, and the thixotropic agent B4% by mass, 0.3% by mass of nitrogen-containing compound, and 37% by mass of solvent were respectively put into the container, and mixed with a crusher to obtain a flux.

[0072] Then, 11% by mass of the obtained flux composition and 89% by mass of the solder powder were put into a container and mixed with a kneader for 2 hours, thereby preparing a solder composition having the composition shown in Table 1 below.

Example

[0073] [Examples 2-11]

[0074] Except that each material was blended according to the composition shown in Table 1, in the same manner as in Example 1, a flux composition and a solder composition were obtained.

Example

[0075] [Comparative Examples 1-12]

[0076] Except that each material was blended according to the composition shown in Table 2, it carried out similarly to Example 1, and obtained the flux composition and the solder composition.

[0077]

[0078] The properties of the solder composition (solder ball, solder spreading, solder meltability, copper plate corrosion) were evaluated by the method described below. The results obtained are shown in Table 1.

[0079] (1) Solder ball

[0080] The solder balls were evaluated by the method according to JIS Z3284 solder ball test. In addition, the solder balls were evaluated according to the following standards.

[0081] A: The degree of aggregation 1 in Appendix 11 Table 1 described in JIS Z3284

[0082] B: The degree of aggregation 2 in Table 1 of Appendix 11 described in JIS Z3284

[0083] C: Condensation degree 3 in Appendix 11 Table 1 described in JIS Z3284

[0084] D: Aggregation degree 4 in Appendix 11 Table 1 described in JIS Z3284

[0085] (2...

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Abstract

The invention provides a flux composition and a solder composition using the same. The flux composition contains resin and an active agent, wherein the active agent contains iodine-class carboxyl compounds.

Description

technical field [0001] The present invention relates to a flux composition and a solder composition using the flux composition. Background technique [0002] The solder composition (solder paste) is a paste-like mixture obtained by kneading a flux composition (rosin-based resin, activator, solvent, etc.) and solder powder. Printability and solder meltability are required for this solder composition, and properties such as easy spread of solder (solder spread) are also required. Therefore, a solder composition containing, as an activator in a flux composition, a halogen-containing activator excellent in solder spread and solder meltability is used. As the halogen-based activator, various components have been studied, and for example, ammonium halide compounds containing halogen atoms such as fluorine, chlorine, and bromine have been proposed (for example, Document 1: JP-A-3-180296). Also, a halogenated organic acid containing a halogen atom such as fluorine, chlorine, or br...

Claims

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Application Information

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IPC IPC(8): B23K35/363B23K35/24
CPCB23K35/3618B23K35/362B23K35/0266B23K35/3613C08K5/09H01L2924/01028H01L2924/01029H01L2924/0103H01L2924/01032H01L2924/01047H01L2924/01049H01L2924/0105H01L2924/01051H01L2924/01079H01L2924/01083
Inventor 中野健原岛启太山下宣宏
Owner TAMURA KK
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