Optical device and optical module
An optical device and diffraction grating technology, applied in the field of optical devices and optical modules, can solve the problems of difficulty in stably forming buried diffraction gratings, poor yield and other problems
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no. 1 approach
[0052] [optical instrument]
[0053] A first embodiment will be described. The optical device in this embodiment mode is a ridge waveguide optical device, and is provided with an active layer 11, a diffraction grating layer 12, a semiconductor buried layer 13 and a cladding layer 14 on a semiconductor substrate 10, such as figure 1 and Figure 2A shown. Diffraction grating 15 is formed by forming concavities and convexities on the surface of diffraction grating layer 12 and burying the concavities and convexities formed on the surface with semiconductor embedding layer 13 . The first buried material layer 21 and the second buried material layer 22 are arranged beside both side surfaces of the clad layer 14 arranged to have a large thickness. The first buried material layer 21 is arranged next to both side surfaces of both end parts of the clad layer 14 arranged to have a large thickness, wherein the end parts are separated from the ends by a predetermined length, and the se...
no. 2 approach
[0058] [optical instrument]
[0059] A second embodiment will be described. The optical device in this embodiment mode is a ridge waveguide optical device, and is provided with a semiconductor buried layer 111, an active layer 112, a first cladding layer 113, and a second cladding layer 114 on a semiconductor substrate 110, such as Figure 4 and Figure 5A shown. Diffraction grating 115 is formed by forming concavities and convexities on the surface of semiconductor substrate 110 and burying the concavities and convexities formed on the surface with semiconductor burying layer 111 . The first buried material layer 121 and the second buried material layer 122 are arranged beside both side surfaces of the second clad layer 114 arranged to have a large thickness. The first buried material layer 121 is arranged beside both side surfaces of the end portion near both ends of the second cladding layer 114 arranged to have a large thickness, and the second buried material layer 122...
no. 3 approach
[0083] [optical instrument]
[0084] A third embodiment will be described. The optical device in this embodiment is provided with an active layer 11, a diffraction grating layer 12, a semiconductor buried layer 13 and a cladding layer 14 on a semiconductor substrate 10, such as Figure 11 and Figure 12A shown. Diffraction grating 15 is formed by forming concavities and convexities on the surface of diffraction grating layer 12 and burying the concavities and convexities formed on the surface with semiconductor embedding layer 13 . The first buried material layer 221 and the second buried material layer 222 are arranged beside both side surfaces of the clad layer 14 arranged to have a large thickness. The first buried material layer 221 is arranged next to both side surfaces of the two end parts of the clad layer 14 arranged to have a large thickness, wherein the end parts are separated from the ends by a predetermined length, and the second buried material layer 222 is arr...
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Abstract
Description
Claims
Application Information
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