Heat dissipation module and centrifugal fan thereof

A centrifugal fan and cooling module technology, applied in indirect heat exchangers, non-variable-capacity pumps, lighting and heating equipment, etc., can solve the problems of reduced thickness of cooling modules, annoying noise, etc., to increase heat dissipation surface area, improve heat dissipation efficacy effect

Inactive Publication Date: 2014-10-15
QUANTA COMPUTER INC
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If the fan speed of the centrifugal fan can be increased, although part of the heat dissipation performance can be compensated, it will also bring annoying noise
Therefore, the heat dissipation performance of the heat dissipation module is facing challenges due to the thickness reduction, and a solution is urgently needed

Method used

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  • Heat dissipation module and centrifugal fan thereof
  • Heat dissipation module and centrifugal fan thereof
  • Heat dissipation module and centrifugal fan thereof

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Embodiment Construction

[0044] The following will clearly illustrate the spirit of the present invention with the accompanying drawings and detailed descriptions. After any person with ordinary knowledge in the art understands the preferred embodiments of the present invention, he can change and modify it by the technology taught in the present invention. without departing from the spirit and scope of the present invention.

[0045] In order to solve the impact of the heat dissipation performance of the existing heat dissipation module due to thickness reduction, the present invention proposes a new centrifugal fan, in which an array of heat dissipation fins is arranged on the inner wall around the axial air inlet of the casing, and is matched with the original arrangement on the fan. Radial air outlet fin arrays are used to increase the overall heat dissipation surface area of ​​the heat dissipation module and improve heat dissipation performance. The specific design of the cooling module equipped w...

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Abstract

The invention discloses a heat dissipation module and a centrifugal fan thereof. The heat dissipation module includes a centrifugal fan, a second heat dissipation fin array, and a heat pipe. The centrifugal fan includes an outer housing, a first heat dissipation fin array, an impeller and a rotation-driving device. The outer housing has an axial air inlet and a radial air outlet. The rotation-driving device is located within the outer housing and used to drive the impeller to rotate. The second heat dissipation fin array is attached to the radial air outlet. An end of the heat pipe is in contact with both the second heat dissipation fin array and a flat wall of the outer housing on which the axial air inlet is located.

Description

technical field [0001] The invention relates to a heat dissipation module, and in particular to a heat dissipation module equipped with a centrifugal fan. Background technique [0002] At present, most notebook computers with high-speed computing performance use active heat dissipation modules in their housings. In other words, the heat dissipation module basically includes a centrifugal fan, a heat pipe, and a heat dissipation fin array. One end of the heat pipe is used to connect to a heat source that requires heat dissipation (such as a central processing unit), and the other end of the heat pipe is used to attach to the heat dissipation fin array for transferring heat to the heat fin array through the heat pipe. The heat dissipation fin array is assembled on the air outlet of the centrifugal fan. When the blades of the centrifugal fan rotate, the heat of the heat dissipation fin array is taken out of the notebook computer by the airflow from the air outlet. [0003] Ho...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20F04D25/08F04D29/30
CPCF28D15/02G06F1/203F28D15/0233F28D15/0275
Inventor 陈庆育
Owner QUANTA COMPUTER INC
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