Semiconductor light source unit and object measuring device

Abstract

The invention discloses a semiconductor light source unit and an object measuring device. The semiconductor light source unit according to one embodiment of the invention includes but not limited to: a light source package; a semiconductor light emitting element; a first radiator; and a first insulating casing . The light source package has a first surface and a second surface opposite to the first surface. The semiconductor light emitting element is included in the light source package, disposed adjacent to the first surface of the light source package, and configured to emit light. The first heat sink is arranged outside the light source package adjacent to the first surface of the light source package, and is configured to receive heat generated by the semiconductor light emitting element via the first surface of the light source package . The first insulating case has a first inlet and a first outlet and covers the light source package and the first heat sink to prevent the light source package and the first heat sink from being exposed to external air.

Description

technical field [0001] The invention relates to semiconductor light sources for measuring devices. In particular, the present invention relates to a semiconductor light source unit suitable for an object measuring device used in a high-temperature environment. [0002] This application claims priority from Japanese Patent Application No. 2013-089032 filed Apr. 22, 2013, the entire contents of which are hereby incorporated by reference. Background technique [0003] In the papermaking process, resin film manufacturing process, etc., the quality of the product is controlled by measuring the water content, color, thickness, etc. of the product. A typical measuring device used for such a measurement transmits light to a sheet-like object such as paper or a resin film, and receives the transmitted or reflected light, thereby performing the measurement. [0004] Conventionally, a halogen lamp having a wide and continuous spectrum has been mainly used as a light source for a meas...

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Problems solved by technology

[0015] For this reason, for semiconductor light sources that do not generate as much heat as halogen lamps, the difference between the temperature of the semiconductor light source and the ambient temperature is smaller, resulting in less effective heat dissipation through the heat sink

For example, in high temperature environments such as Figure 7 With the light source used in the cooling structure 600 shown, it cannot be expected that the heat sink 620 will release heat

In addition, when the temperature of the outside air is higher than the temperature of the light source, heat will enter the cooling structure through the heat sink 620, causing the temperature of the semiconductor light source 610 to rise.

[0016] Even in the case where an electric cooling element such as a Peltier cooling element is placed between the semiconductor light source 610 and the heat sink 620, if the heat sink 620 does not sufficiently release heat, the semiconductor light source 610 is also subjected to heat generated by the electric cooling element. The effect of the heat generated, so that the cooling effect cannot be achieved

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