Processing method of high-current printed circuit board and high-current printed circuit board

Abstract

The embodiment of the present invention discloses a high-current printed circuit board and a processing method thereof, wherein, a processing method of a high-current printed circuit board may include: slotting a dummy layer to form a slot for accommodating a large-current conductor block ; Place the large current conductor block in the groove; Laminate the dummy layer between the first sheet set and the second sheet set, the first sheet set and / or the second sheet set include at least one circuit pattern layer; The large current conductor block is connected and conducted with the circuit pattern layer in the first plate set and / or the second plate set. The solution of the embodiment of the present invention is beneficial to improve the reliability of the PCB, and reduce the occupation of the circuit layer wiring space by the large current conductor block.

Description

technical field [0001] The invention relates to the field of circuit board production, in particular to a processing method of a high-current printed circuit board and a high-current printed circuit board. Background technique [0002] In many scenarios, high-power printed circuit boards (PCB, Printed Circuit Board) are required, such as high-power power amplifier PCBs, automotive electronics PCBs, and other electronic products that require high current (such as current > 5A or 30A) and signals. [0003] At present, such PCBs carrying large currents usually use conductor blocks carrying high currents to be directly embedded in the circuit layer (wherein, the conductor blocks carrying high currents can be referred to as high-current conductor blocks, and the large-current conductor blocks are, for example, copper block) way to carry a large current, due to the extremely harsh environment of high current use, there will be many problems in terms of long-term reliability. F...

AI Technical Summary

Problems solved by technology

For example, burrs may be generated when making high-current conductor blocks, and the distance between high-current conductor blocks and other holes and lines may be relatively close. Therefore, in the long-term high-current working process, short circuits and other defects are prone to occur due to electro-chemical migration, which makes the reliability of the PCB Not good; moreover, the high-current conductor block is directly buried in the circuit layer, which takes up more space in the circuit layer and affects the wiring

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