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Multilayer ceramic electronic component and mounting board therefor

A technology of multi-layer ceramics and electronic components, applied in the direction of electrical components, multilayer capacitors, fixed capacitor electrodes, etc., can solve the problems of multi-layer ceramic capacitors, dumping, etc. that are not publicly solved

Active Publication Date: 2014-11-05
SAMSUNG ELECTRO MECHANICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, Patent Document 1 does not disclose an element or method for solving the defect that the multilayer ceramic capacitor falls when mounted on a printed circuit board.

Method used

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  • Multilayer ceramic electronic component and mounting board therefor
  • Multilayer ceramic electronic component and mounting board therefor
  • Multilayer ceramic electronic component and mounting board therefor

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Embodiment Construction

[0031] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0032] This invention may be embodied in different forms and the invention should not be construed as limited to the embodiments set forth herein.

[0033] Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.

[0034] In the drawings, the shapes and sizes of elements may be exaggerated for clarity.

[0035] In addition, the same reference numerals will be used throughout the drawings to designate the same or similar elements.

[0036] Hereinafter, a multilayer ceramic electronic component according to an embodiment of the present invention will be described. In particular, a multilayer ceramic capacitor will be described by way of example. However, the present invention is not limited thereto.

[0037] Multilayer Ceramic Cap...

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Abstract

There is provided a multilayer ceramic electronic component including a ceramic body satisfying T / W>1.0 when a width and a thickness thereof are defined as W and T, respectively, a plurality of first and second internal electrodes having the respective dielectric layers interposed therebetween, and alternately exposed through both end surfaces of the ceramic body, and first and second external electrodes formed to be extended from the both end surfaces to both upper and lower main surfaces of the ceramic body, wherein, the ceramic body is formed such that a cross-section thereof in a width-thickness direction has a trapezoidal shape in which two sides among four sides are inclined in one direction, and when an angle formed by a bottom side and a side connected thereto is defined as θ, 86°≰θ<90° is satisfied.

Description

[0001] Cross References to Related Applications [0002] This application claims priority from Korean Patent Application No. 10-2013-0048126 filed with the Korean Intellectual Property Office on Apr. 30, 2013, the entire contents of which are hereby incorporated by reference into this application. technical field [0003] The invention relates to a multilayer ceramic electronic component and a mounting board used for the multilayer ceramic electronic component. Background technique [0004] With the recent trend of miniaturization of electronic products, there is a demand for smaller size and larger capacitance of multilayer ceramic electronic components used in electronic products. [0005] Therefore, reducing the thickness of the dielectric layer and internal electrodes and increasing the number of dielectric layer and internal electrode stacks have been done in various ways. Recently, multilayer ceramic electronic components have been fabricated with an increased number ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01G4/12H01G4/30H01G2/06H01G4/005
CPCH01G4/30H05K1/181H01G4/12H01G4/232H01G2/06
Inventor 韩丙禹小野雅章崔才烈金相赫
Owner SAMSUNG ELECTRO MECHANICS CO LTD