Welding pad structure and display device

Abstract

The invention discloses a welding pad structure and a display device. The welding pad structure comprises a first welding pad unit and a second welding pad unit which are electrically connected by crimping; the first welding pas unit is divided into at least two welding areas, namely the welding pad structure is divided into at least two welding areas, and a detection unit is arranged for each welding area, so that contact resistance between a first welding pad plate and a second welding pad plate in each welding area can be estimated by a detection welding pad plate and a comparison circuit in the corresponding detection unit, and thereby current of different welding areas can be adjusted according to estimated result, and influence on signal transmission caused by nonuniform contact resistance of different welding areas of the welding pad structure can be improved; and therefore, when the welding pad structure is applied to a display device, the problem that the display product is unqualified due to nonuniform contact resistance of different welding areas of the welding pad structure can be overcome.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a pad structure and a display device. Background technique [0002] With the development of the electronics and communication industries, the development of light-emitting diodes (Light Emitting Diode, LED), organic light-emitting diodes (Organic Light Emitting Diode, OLED), plasma displays (Plasma Display Panel, PDP) and liquid crystal displays (Liquid Crystal Display, LCD) ) and other flat panel display devices are increasing day by day. The development trend of flat panel display devices is light, thin, short, and small. Packaging technology with high density, small volume, and high installation freedom is required to meet the above requirements. Therefore, Chip on Glass (COG) packaging Technology came into being. [0003] COG is to fix the driver chip on the display panel, use the display panel as the carrier for packaging the driver chip, and bond the driver chip wi...

AI Technical Summary

Problems solved by technology

[0005] Based on some problems existing in the current COG process, such as in the above-mentioned COG structure, the flatness of the pad structure is not good, the ACF is abnormal, and the two pads that are electrically connected have alignment offsets, etc., which will cause the pad structure to be damaged. The contact resistance of different welding areas is uneven, which affects the transmission of signals, resulting in the hidden danger of abnormal display in the subsequent use of display products, and the contact resistance of the pad structure will also change with the accumulation of time, temperature and humidity

[0006] Therefore, how to improve the defective display products caused by the non-uniform contact resistance of different welding areas of the pad structure is a technical problem that those skilled in the art need to solve urgently.

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