Ultrasonic vibration electroplating method and electroplating device for mount chip electronic component
An electronic component and mounting chip technology, which is applied in the field of electroplating method and electroplating device for mounting chip electronic components, can solve the problems that the effect needs to be improved, and achieve the improvement of the product qualification rate, the improvement of the qualification rate, and the uniform vibration Effect
Active Publication Date: 2014-12-17
谢君广
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Problems solved by technology
The above methods can reduce the probability of sticking, but the effect needs to be improved, and there is still a certain probability of sticking
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[0023] refer to figure 1 , the ultrasonic vibration electroplating method for mounting chip electronic components provided by the present invention comprises the following steps: Step 1: pretreating the surface of mounting chip electronic components; Step 2: applying pretreated mounting chips Electroplate nickel on the surface of electronic components; Step 3: Electroplate tin on the surface of chip electronic components that have been nickel-plated; During the tinning process, use ultrasonic waves to cause strong vibration and movement of chip electronic components; Step 4: Post-processing.
[0024] The ultrasonic vibration electroplating method for chip-mounted electronic components provided by the present invention uses ultrasonic waves to cause strong vibration and movement of chip-mounted electronic components during the tinning process, which can effectively avoid surface-mounted chip-type electronic components. They are bonded together during electroplating, thereby im...
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The invention provides an ultrasonic vibration electroplating method for a mount chip electronic component. The method includes the steps of: 1. conducting pretreatment on the surface of the mount chip electronic component; 2. performing electronickelling on the pretreated mount chip electronic component; 3. cleaning the surface of the nickel plated mount chip electronic component; 4. carrying out electrotinning on the surface of the nickel plated mount chip electronic component, and causing violent vibration and movement of the mount chip electronic component by ultrasonic wave during electrotinning; and 5. conducting after-treatment. The ultrasonic vibration electroplating method for the mount chip electronic component provided by the invention utilizes ultrasonic wave to cause violent vibration and movement of the mount chip electronic component, can effectively avoid bonding of the surface mount chip electronic component together during electrotinning, thereby improving the qualified rate of products. Compared with existing electroplating methods, the method provided by the invention utilizes ultrasonic wave to increase vibration of the mount chip electronic component, the vibration is violent and also even, so that the qualified rate of products is greatly improved.
Description
technical field [0001] The invention relates to the technical field of electroplating, in particular to an electroplating method and an electroplating device suitable for mounting chip electronic components. Background technique [0002] The processing and manufacturing of small surface mount chip capacitors, chip inductors, chip resistors and other chip electronic components requires electroplating. The specific electroplating method sequentially includes: pretreatment, nickel plating, cleaning, tin plating and posttreatment. [0003] In the existing processing method, the vibration and movement of surface mount chip electronic components and conductive balls in the tinning process are all realized by the mechanical vibration and rotation of the electroplating equipment. In such a processing process, surface mount chip electronic components have some products bonded together during tin plating, resulting in unqualified products, which are customarily called sticky chips, l...
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Inventor 谢君广
Owner 谢君广