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Desiccant composition for moisture-sensitive electronic devices

A desiccant and composition technology, applied in the direction of dispersion particle separation, other chemical processes, separation methods, etc., can solve problems such as unmentioned, difficult film, saturation reduction, etc.

Active Publication Date: 2014-12-17
SAES GETTERS SPA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Even though a reduction in saturation caused by exposure to moisture prior to sealing of sensitive devices can be achieved, US 6,673,436 is silent on how to optimize this to combine this protective effect with preservation of absorbent properties (i.e. Residual humidity (up to 80% of total moisture absorption capacity))
In addition, it is very difficult to obtain a uniform and controlled film on the resinous adhesive, so there is no guarantee to achieve the final absorption properties that make it suitable for electronic devices and easy to use in their production process

Method used

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  • Desiccant composition for moisture-sensitive electronic devices

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] The polymer-encapsulated desiccant according to the present invention was produced by spray drying a stock solution comprising desiccant powder particles (CaO, 22.5 g) dispersed in a suitable suspending agent (toluene, 1425 g), The encapsulating polymer (PMMA, 52.5 g) was dissolved in the suspending agent. The solution was sprayed at high temperature to promote rapid volatilization of the suspending agent (toluene, 120°C).

[0022] The collected powder (5 grams) was added to a polymer matrix (epoxy resin, 27.5 grams) along with unencapsulated drying agent (CaO, 17.5 grams). The mixture was mechanically mixed and stored under a refrigerated, dry atmosphere.

[0023] Desiccant samples were obtained by leaf distribution on stainless steel substrates and final maturation at 150°C for 1 hour.

[0024] The adsorption characteristics of the desiccant samples at 22° C. and 55% relative humidity were tested by gravimetric test, and the results showed that 80% of the residual a...

Embodiment 2

[0026] The polymer-encapsulated desiccant according to the present invention was prepared by spray drying a stock solution comprising desiccant powder particles (CaO, 22.5 g) dispersed in a suitable suspending agent (toluene, 1425 g), The encapsulating polymer (polysulfone PSU, 52.5 g) was dissolved in the suspension. The solution was sprayed at high temperature to promote rapid volatilization of the suspending agent (toluene, 120°C).

[0027] The collected powder (7.5 g) was mixed with unencapsulated desiccant (Li 2 0, 17.5 g) into a polymer matrix (epoxy resin, 27.5 g). The mixture was mechanically mixed and kept under a refrigerated, dry atmosphere.

[0028] Desiccant samples were obtained by leaf distribution on stainless steel substrates and final maturation at 150°C for 1 hour.

[0029] The adsorption characteristics of the desiccant samples at 22° C. and 55% relative humidity were tested by gravimetric test, and the results showed that after exposure for 24 hours, 85...

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Abstract

A desiccant composition containing a polymeric binder (3) and a dispersion of powders of desiccant materials (1, 2), in which the desiccant powders (1, 2) are dispersed at least in part in the form of micro aggregates of desiccant particles (2) surrounded by a polymeric encapsulating material (4) having a different composition with respect to the polymeric binder (3).

Description

technical field [0001] The present invention relates to improved desiccant compositions comprising powders of desiccant material dispersed in a polymer matrix, suitable for controlling humidity levels in encapsulated electronic devices to prevent premature breakage and / or of said encapsulated electronic devices Its performance deteriorates. Background technique [0002] Various electronic and industrial devices require humidity levels in the range of approximately 0.1 pm to 5000 pm of water vapor because the performance of these devices is affected by moisture. Examples of such devices are microelectromechanical devices (MEM), micro optoelectromechanical devices (MOEM), optoelectronic devices for telecommunication applications, implantable medical devices (pacemakers, defibrillators), organic electronic devices (eg OLEDs and OLETs). [0003] Conservation of these devices is typically accomplished by encapsulating the device with a sealant suitable for reducing the transmis...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08K3/22C08K3/34C09K3/32
CPCC08K3/22C08K3/34B01D53/28
Inventor 乔治·马基亚历山德拉·科隆博保罗·瓦卡罗伯托·詹南托尼奥
Owner SAES GETTERS SPA
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