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One-component, solvent-free organosiloxane composition

A technology of organosiloxane and polyorganosiloxane, which is applied in the direction of surface coating liquid devices, printed circuits, coatings, etc., and can solve problems such as uneven layer thickness

Inactive Publication Date: 2014-12-24
ELANTAS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] If the viscosity of the coating material is too low, there is a risk that the coating material will flow after it has been applied to the electrical or electronic component, which can cause the layer thickness to become unevenly thick or to cover areas of the component that were not intended to be coated coated material

Method used

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  • One-component, solvent-free organosiloxane composition
  • One-component, solvent-free organosiloxane composition
  • One-component, solvent-free organosiloxane composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0162] Thoroughly mix 300 parts by weight of polydivinyldimethylsiloxane (component A) with a viscosity of 50 mPa·s, 30 parts by weight of polydimethylsiloxane (component A) with a Si-H content of 7 mmol / g Component B), 5 parts by weight of 3,5-dimethyl-1-hexyn-3-ol (component D), 0.5 parts by weight of 1% Karstedt's 1,2-divinyltetramethyldi A silicone solution (component C), and a base mixture of 170 parts by weight of a linear polydimethylsiloxane having terminal vinyl groups and terminal Si-H units (component F). At 25°C, the viscosity of the mixture was 40 mPa·s.

[0163] Then, 0.1 parts by weight of diepoxy polysiloxane (component G) with a viscosity of 10 mPa·s and 3 parts by weight of fumed silica coated with dimethylsilane were added to 96 parts by weight of the mixture (Component E).

[0164] At 25°C, in 0.01s -1 The viscosity measured at the shear rate is 430000mPa·s, at 500s -1 The viscosity measured at the shear rate is 120mPa·s.

[0165] Coated according to t...

Embodiment 2

[0167] To 98 parts by weight of the base mixture from Example 1 were added 0.1 parts by weight of diepoxypolysiloxane (component G) with a viscosity of 10 mPa·s and fumed dioxide partially coated with dimethylsilane. Silicon (component E).

[0168] At 25°C, in 0.01s -1 The viscosity measured at the shear rate is 8000mPa·s, at 11s -1 The viscosity measured at the shear rate is 120mPa·s.

[0169] Coated according to the method described above, a uniform coating curtain was obtained, and after coating, the coating on the printed circuit board did not flow anymore.

Embodiment 3

[0171] To 97 parts by weight of the base mixture from Example 1 were added 1 part by weight of diepoxypolysiloxane (component G) with a viscosity of 10 mPa·s and 2 parts by weight of uncoated fumed silica ( Component E).

[0172] At 25°C, in 0.01s -1 The viscosity measured at the shear rate is 390000mPa·s, at 400s -1 The viscosity measured at the shear rate is 120mPa·s.

[0173] Coated according to the method described above, a uniform coating curtain was obtained, and after coating, the coating on the printed circuit board did not flow anymore.

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Abstract

One-component, solvent-free organosiloxane composition comprising a) a linear or branched polyorganosiloxane containing at least two alkenyl or alkynyl groups, as component A; b) a linear or branched polyorganosiloxane containing at least 3 Si-H groups, as component B; c) a hydrosilylation catalyst as component C; d) an alkynol of the general formula (I) wherein R1, R2, R3 are selected independently of one another from H, C1-C6-alkyl and substituted or unsubstituted C3-C6-alkyl; or R1 is selected from H, C1-C6-alkyl and substituted or unsubstituted C3-C6-cycloalkyl, and R2, R3 are bonded together and form a 3- to 8-membered ring which can be substituted by one or more C1-C3-alkyl groups, as component D; and e) a fumed silica as component E; and f)0-89.79989wt% one or more other components selected from F, G, H and I, wherein the total of components A to I is 100%wt.

Description

technical field [0001] The present invention relates to a one-component, solvent-free organosiloxane composition comprising fumed silica and an acetylenic alcohol, and the use of said composition to apply a protective organosiloxane coating to printed circuits by means of a cross-cut nozzle plates, and such organosiloxane protective coatings. Background technique [0002] Electrical and electronic assemblies, especially printed circuit boards, have become smaller in recent years to allow for higher packing densities. Premature failure of such components due to moisture, dust and thermal and mechanical stress can be prevented by protective varnishes or coatings. Higher demands are placed on the painting or coating process. In many cases, in addition to allowing uniform layer thicknesses and reproducible coating effects, they must also allow selective lacquer application. [0003] Contact areas, plug connectors, mechanical components, etc. must not be wetted by the protecti...

Claims

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Application Information

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IPC IPC(8): C08L83/07C08L83/05C08L83/06C08K13/02C08K5/05C08K3/36C09D183/07C09D183/05C09D183/06C09D7/12B05D7/24H05K3/28
CPCH05K1/0326H05K3/285H05K2201/0162H05K2201/09827C08L83/04C08K3/36C08K5/005C08K5/05C08K5/56C08L83/00Y10T428/31663C09D183/04H05K3/46
Inventor 金·巴斯蒂安·贝本罗斯安德烈亚斯·施泰因曼格罗尔德·施密特
Owner ELANTAS
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