Enhancement heat conduction structure for high-power CCD of space optical remote sensor

A technology of space optical remote sensing and thermal conduction structure, applied in electric solid devices, semiconductor devices, semiconductor/solid device components and other directions, can solve the problems of limited thermal conduction path, large contact thermal resistance, low thermal conduction efficiency, etc., to increase the contact area, improving thermal conductivity, and the effect of large heat dissipation channels

Inactive Publication Date: 2014-12-24
CHANGCHUN INST OF OPTICS FINE MECHANICS & PHYSICS CHINESE ACAD OF SCI
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Problems solved by technology

[0005] The purpose of the present invention is to propose a high-power CCD synergistic heat conduction structure for space optical remote sensors, which solves the problem of limited heat conduction paths of CCD devices in the prior art, small contact area between the fixed member on the back of the device and the mounting substrate, large contact thermal resistance and The problem of low heat conduction efficiency meets the heat conduction requirements of high-power CCD devices

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  • Enhancement heat conduction structure for high-power CCD of space optical remote sensor
  • Enhancement heat conduction structure for high-power CCD of space optical remote sensor

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Embodiment Construction

[0014] Embodiments of the present invention will be further described below in conjunction with the accompanying drawings.

[0015] See attached figure 1 , the space optical remote sensor high-power CCD synergistic heat conduction structure of the present invention is a single integral component composed of a device press plate 1, a fixed end 2 and a synergistic heat conduction end 3; the fixed end 2 is located at both ends of the device press plate 1, so A plurality of slots 6 are evenly processed between the synergistic heat-conducting end 3 and the device pressing plate 1 , and the slots 6 correspond to the device pins on the back of the CCD device 4 one by one.

[0016] The distance between the side wall of the slot 6 and the device pin is the minimum safe distance of the device pin, that is, the width of the slot 6 is as small as possible on the basis of ensuring a safe distance from the device pin.

[0017] The material of the synergistic heat conduction structure is co...

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Abstract

The invention provides an enhancement heat conduction structure for a high-power CCD of a space optical remote sensor, and belongs to the technical field of space optical remoter sensors. The structure aims to solve the problems that in the prior art, heat conduction paths of a CCD are limited, the contact area between a fixing component at the back of the CCD and an installation substrate is small, thermal contact resistance is large and heat conduction efficiency is low. The enhancement heat conduction structure for the high-power CCD of the space optical remote sensor is an integral component composed of a device pressing plate, fixing ends and an enhancement heat conduction end. The fixing ends are located at the two ends of the device pressing plate, multiple narrow grooves are evenly machined between the enhancement heat conduction end and the device pressing plate, and the narrow grooves correspond to device pins at the back of the CCD in a one-to-one mode. On the basis that the CCD is fixed, the enhancement heat conduction end is designed, the heat conduction paths of the back of the device are effectively increased, the contact area between the CCD and the installation substrate is increased, heat conduction efficiency is improved, and the heat conduction requirement of the high-power CCD is met.

Description

technical field [0001] The invention belongs to the technical field of space optical remote sensors, and in particular relates to a high-power CCD synergistic heat conduction structure for space optical remote sensors. Background technique [0002] In recent years, space optical remote sensor technology has developed rapidly, and high-resolution and multi-spectral technology has become one of the main development directions. The improvement of the resolution index of the remote sensor and the demand for high-speed imaging rate have greatly increased the power consumption of the imaging detection device of the remote sensor. The power consumption generated during the operation of the imaging detection device is mainly converted into heat energy to increase the temperature, thereby affecting the dark current of the device. flat. In order to effectively reduce the dark level of the detection device and improve the signal-to-noise ratio of the camera, the heat generated by the ...

Claims

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Application Information

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IPC IPC(8): H01L23/367
Inventor 刘巨高志良韩诚山
Owner CHANGCHUN INST OF OPTICS FINE MECHANICS & PHYSICS CHINESE ACAD OF SCI
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