6results about How to "Extended thermal path" patented technology

The invention relates to a cooling structure for an ultraprecise linear motor and belongs to the technical field of linear motors. The cooling structure solves the problem of proneness to heat exchange with environment caused by high side temperature of two-side surface-mounted cooling structures of existing linear motors. The cooling structure comprises a winding supporting portion, a winding and a heat conductive portion, wherein the winding is fixed on the surface of the winding supporting portion, the heat conductive portion is arranged on the surface on the outer side and fixedly connected with the winding supporting portion, the heat conductive portion is a copper foil ring which fits the outer profile of the winding and is sleeved and fixed on the surface on the outer side of the winding, or the heat conductive portion is a copper foil heat conductive ring formed by arraying multiple copper foil sections in a dispersed manner, the copper coil heat conductive ring fits the outer profile of the winding, and each copper coil section is fixed on the surface on the outer side of the winding. The cooling structure for the ultraprecise linear motor is suitable for cooling of linear motors.

The utility model provides a high-reliability SIC-MOSFET terminal structure, belonging to the technical field of semiconductor devices, the high-reliability SIC-MOSFET terminal structure comprises a source electrode and a drain electrode, the source electrode is the input end of an MOSFET and is used for current in a circuit to enter, and the drain electrode is the output end of the MOSFET and is used for exporting current; a groove and a grating are arranged between the source electrode and the drain electrode, the structure among the source electrode, the drain electrode, the groove and the grating is a FinFET structure, the source electrode and the drain electrode are fixedly connected through the middle groove and the grating, the groove is fixedly connected with the grating, the groove comprises a first groove and a second groove, and the first groove and the second groove are communicated with each other. The first groove is fixedly connected with the source electrode. The problem that an existing SIC-MOSFET0 is prone to being broken down under the conditions of high voltage and high current can be solved.

A physical information machine learning design method of a multi-component composite high-thermal-conductivity filler belongs to the technical field of composite high-thermal-conductivity filler design, and comprises the following steps: S1, establishing a material intrinsic attribute data set; s2, establishing a three-dimensional space closest packing model; s3, setting boundary constraint conditions; s4, optimizing a machine learning algorithm; and S5, carrying out proportion conversion. According to the method, an existing machine learning technology is utilized, a comprehensive data set is constructed, a machine learning algorithm is applied, the porosity is reduced and heat conduction paths are increased through accurate material particle size matching, and different three-dimensional space closest packing theoretical models are correspondingly selected according to material intrinsic attributes; therefore, on the basis of optimizing the stacking structure of the optimal filler of the heat-conducting polymer composite material, forming an efficient heat-conducting path and keeping the processing performance of the heat-conducting polymer composite material, the design and manufacturing processes are simplified, the production efficiency is improved, and powerful technical support is provided for effective heat dissipation and reliable and stable work of electronic equipment.

This utility model relates to the field of internal heat dissipation technology for DC charging piles, and discloses a modular high-efficiency heat dissipation DC charging pile, including a main shell, a charging gun installed in the middle of the main shell, and multiple frame mounting components inside the main shell. The power module and its electronic components are housed inside the frame mounting components, and a heat dissipation component is located in the middle of the power module and its electronic components. The heat dissipation component directly adheres to the power module and its electronic components through a heat-conducting plate, which can quickly absorb a large amount of heat generated by the core components, avoiding the problem of concentrated heat accumulation in traditional "overall heat dissipation". At the same time, multiple heat-conducting plates are added to the outside of the heat-conducting plate to further expand the heat conduction area. In addition, multiple moving wheels are installed in the wheel assembly shell of the moving component, which can drive the heat dissipation component to slide flexibly along the sliding limit plate, which is convenient for precise alignment of the power module during installation or quick removal of the heat dissipation component for cleaning during maintenance.

This application provides a temperature detection device and a temperature detection system. The device includes: a first cover and a second cover, which together form a receiving space. The first cover is a portion close to the skin, and the second cover is a portion away from the skin. A first circuit board is disposed within the receiving space. A temperature detection device is disposed on the side of the first circuit board near the first cover and connected to the first circuit board. A metal bracket is disposed on the same side of the first circuit board as the temperature detection device and is thermally connected to the temperature detection device. Thermally conductive adhesive is filled in the gap between the first cover and the first circuit board and is in contact with at least a portion of the metal bracket. The temperature detection device and temperature detection system provided by this application can reduce the thermal resistance on the heat conduction path.

The invention discloses a novel superconducting magnet conduction cooling structure, which belongs to the technical field of superconducting motors and comprises a first copper plate, a second copper plate, a connecting copper block and a copper braid. The first copper plate and the second copper plate are oppositely arranged on the upper surface and the lower surface of the superconducting magnet to form a magnet supporting and cooling framework; connecting copper blocks are symmetrically arranged on the two sides of the framework. The connecting copper blocks are symmetrically arranged on the two sides of the framework, each connecting copper block comprises a supporting part and an expanding part, each supporting part is arranged between the corresponding first copper plate and the corresponding second copper plate, and each expanding part is arranged on the outer side of the corresponding supporting part and bends and extends towards the bottom of the corresponding second copper plate; and the two ends of the copper braid are connected with the symmetrically arranged expansion parts of the connecting copper block. According to the structure, the utilization of a cooling medium is greatly enhanced, the cooling effect is obvious, the structure is simple, machining is easy, and cost is low.