3results about How to "Extended thermal path" patented technology

The invention relates to a cooling structure for an ultraprecise linear motor and belongs to the technical field of linear motors. The cooling structure solves the problem of proneness to heat exchange with environment caused by high side temperature of two-side surface-mounted cooling structures of existing linear motors. The cooling structure comprises a winding supporting portion, a winding and a heat conductive portion, wherein the winding is fixed on the surface of the winding supporting portion, the heat conductive portion is arranged on the surface on the outer side and fixedly connected with the winding supporting portion, the heat conductive portion is a copper foil ring which fits the outer profile of the winding and is sleeved and fixed on the surface on the outer side of the winding, or the heat conductive portion is a copper foil heat conductive ring formed by arraying multiple copper foil sections in a dispersed manner, the copper coil heat conductive ring fits the outer profile of the winding, and each copper coil section is fixed on the surface on the outer side of the winding. The cooling structure for the ultraprecise linear motor is suitable for cooling of linear motors.

This utility model relates to the field of internal heat dissipation technology for DC charging piles, and discloses a modular high-efficiency heat dissipation DC charging pile, including a main shell, a charging gun installed in the middle of the main shell, and multiple frame mounting components inside the main shell. The power module and its electronic components are housed inside the frame mounting components, and a heat dissipation component is located in the middle of the power module and its electronic components. The heat dissipation component directly adheres to the power module and its electronic components through a heat-conducting plate, which can quickly absorb a large amount of heat generated by the core components, avoiding the problem of concentrated heat accumulation in traditional "overall heat dissipation". At the same time, multiple heat-conducting plates are added to the outside of the heat-conducting plate to further expand the heat conduction area. In addition, multiple moving wheels are installed in the wheel assembly shell of the moving component, which can drive the heat dissipation component to slide flexibly along the sliding limit plate, which is convenient for precise alignment of the power module during installation or quick removal of the heat dissipation component for cleaning during maintenance.

This application provides a temperature detection device and a temperature detection system. The device includes: a first cover and a second cover, which together form a receiving space. The first cover is a portion close to the skin, and the second cover is a portion away from the skin. A first circuit board is disposed within the receiving space. A temperature detection device is disposed on the side of the first circuit board near the first cover and connected to the first circuit board. A metal bracket is disposed on the same side of the first circuit board as the temperature detection device and is thermally connected to the temperature detection device. Thermally conductive adhesive is filled in the gap between the first cover and the first circuit board and is in contact with at least a portion of the metal bracket. The temperature detection device and temperature detection system provided by this application can reduce the thermal resistance on the heat conduction path.