A high-power device heat dissipation device and method

A technology of high-power devices and heat dissipation methods, which is applied to the heat dissipation of high-power devices on aerospace vehicles. In the field of aerospace, it can solve the problems that cannot meet the heat dissipation requirements of high-power devices, so as to prevent high-temperature failure, increase the contact area, and ensure normal working effect

Active Publication Date: 2021-07-13
BEIJING RES INST OF TELEMETRY +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the past, only relying on the contact heat dissipation method between the printed board and the aluminum frame can no longer meet the heat dissipation requirements of high-power devices.

Method used

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  • A high-power device heat dissipation device and method
  • A high-power device heat dissipation device and method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0044] Such as figure 1 As shown, a heat dissipation method for a high-power device, the bottom of the high-power device is welded on the printed board through welding legs, the top of the high-power device is connected to the graphite heat spreader through a heat conduction pad, and the graphite heat spreader is fixedly connected to the frame , and the connection position between the frame and the graphite heat expansion plate has a heat conduction boss, the height of the heat conduction boss is 8-10mm, the graphite heat expansion plate is fixedly connected to the heat conduction boss of the frame through thermal grease, and the frame is fixedly connected to the cold plate; heat conduction The thickness of the pad is 0.4-0.5mm; there is a boss at the connection position between the graphite heat expansion plate and the heat conduction pad, and GD-414 glue is applied between the boss on the graphite heat spreader and the heat conduction pad.

[0045] First paste one side of th...

Embodiment 2

[0047] Such as figure 2 As shown, a heat dissipation method for high-power devices, the upper surface of the printed board is connected to the high-power device, the lower surface of the printed board is connected to the frame, and the connection between the upper surface of the printed board and the high-power device is coated with copper There are several through-holes on the connecting part of the printed board and the high-power device. The inner surfaces of the several through-holes are coated with a copper layer. The thickness of the copper layer is 0.025mm. The bottom of the high-power device is welded through the belly The disk is welded on the printed board; the diameter of the through hole is 0.2-0.3mm, and the number of the through hole is 20-30.

[0048] A method for dissipating heat from a high-power device, the steps of the method comprising:

[0049] (1) Process several through holes on the printed board;

[0050] (2) coating copper layer on the inner surface...

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PUM

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Abstract

The invention relates to a heat dissipation device and method for high-power devices, belonging to the technical field of aerospace, in particular to the technical field of heat dissipation for high-power devices on aerospace vehicles. The present invention cooperates with the layout of the printed board, processes the graphite heat expansion plate, and makes a boss on the heat expansion plate corresponding to the position of the high-power device on the printed board; fixes the printed board with the welded components on the frame, and measures the high power The distance between the top surface of the device and the installation surface of the heat expansion plate is based on the measured distance, and the height of the heat dissipation boss of the graphite heat expansion plate is matched. Grease, for heat dissipation devices with pads on the abdomen, increase the heat conduction path.

Description

technical field [0001] The invention relates to a heat dissipation device and method for high-power devices, belonging to the technical field of aerospace, in particular to the technical field of heat dissipation for high-power devices on aerospace vehicles, where a high-power device means that the power of the device is not less than 5W. Background technique [0002] Excessive temperature rise of high-power devices is a problem often encountered in the field of engineering technology. As the size of the electronic equipment inside the aerospace vehicle becomes smaller and the power of the device is higher and higher, the heat dissipation of high-power devices has become a difficult point in product design. The previous method of only relying on the contact heat dissipation between the printed board and the aluminum frame can no longer meet the heat dissipation requirements of high-power devices. Contents of the invention [0003] When the technology of the present invent...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/373H01L23/367
CPCH01L23/367H01L23/373
Inventor 崔冠宇王宇郭益
Owner BEIJING RES INST OF TELEMETRY
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