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Heat dissipation system

A heat dissipation system and heat dissipation frame technology, applied in the direction of indirect heat exchangers, heat exchange equipment, lighting and heating equipment, etc., can solve problems such as difficult to achieve heat dissipation effect

Active Publication Date: 2021-03-12
INVENTEC PUDONG TECH CORPOARTION +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the traditional air-cooled heat dissipation design will be difficult to achieve the required heat dissipation effect

Method used

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Embodiment Construction

[0036] The detailed features and advantages of the present invention are described in detail below in the embodiments, which are sufficient to enable those skilled in the art to understand the technical content of the present invention and implement it accordingly, and according to the contents disclosed in this specification, claims and accompanying drawings , those skilled in the art can easily understand the related objects and advantages of the present invention. The following examples are to further describe the viewpoints of the present invention in detail, but not to limit the scope of the present invention in any way.

[0037] see Figure 1 to Figure 4 . figure 1 It is a perspective view of the heat dissipation system according to the first embodiment of the present invention. figure 2 for figure 1 A stereogram from another perspective. image 3 for figure 1 The decomposition diagram. Figure 4 for figure 1 partial sectional view.

[0038] The heat dissipation...

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Abstract

A heat dissipation system is suitable for being thermally coupled to a heat source. The heat dissipation system comprises a centrifugal fan, a heat pipe, a radiator and a heat conduction frame set. The centrifugal fan comprises a shell and a fan blade. The shell is provided with a containing space, an air inlet and an air outlet, wherein the air inlet and the air outlet are communicated with the containing space. The fan blades are located in the containing space. The heat pipe is thermally coupled to the heat source. The radiator is located at the air outlet and thermally coupled to the heatpipe. The heat conduction frame set comprises a heat absorption frame and a heat dissipation frame. The heat absorption frame is used for assembling a heat source and thermally coupled with the heat source. The heat dissipation frame is arranged on a shell of the centrifugal fan and is partially located in the containing space. The heat dissipation frame is thermally coupled to the heat absorptionframe.

Description

technical field [0001] The invention relates to a heat dissipation system, in particular to a heat dissipation system with dual heat conduction paths. Background technique [0002] Along with the change of people's computer usage habit, notebook computer has become the very important product type on the market. Due to the small size and portability of laptops, people often take them to commute, do some paperwork in the office, read some articles or videos on the Internet in coffee shops, and may also use laptops to play video games with three or five friends. game. If the user particularly requires the smoothness of the notebook computer in video games or the fineness of the picture, it is necessary to equip the notebook computer with a more advanced processor and display chip. However, more advanced processors and display chips are accompanied by the problem of excessive waste heat, and the volume of notebook computers is limited, so the heat dissipation design is often n...

Claims

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Application Information

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IPC IPC(8): G06F1/20
CPCG06F1/203H01L23/427H01L23/467F28D15/0233F28D15/0275G06F1/20Y02D10/00F28F3/025H01L23/3672F28D15/00F28D15/0266F28D15/04F28D15/043H05K7/20136
Inventor 谢时昕杨智凯
Owner INVENTEC PUDONG TECH CORPOARTION
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