Electronic device shell structure and forming method thereof
A technology for electronic devices and shell structures, which is applied in the direction of electronic equipment, chemical instruments and methods, electrical equipment shells/cabinets/drawers, etc., which can solve the problem of increased production line costs, affecting heat dissipation effects, and uneven attachment of aluminum foil or graphite sheets Shell and other problems, to save processing costs and improve the effect of heat dissipation
Inactive Publication Date: 2014-12-24
INVENTEC PUDONG TECH CORPOARTION +1
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Problems solved by technology
However, this method can only be completed through post-production processing, resulting in increased costs on the production line
In addition, due to the different shapes of the casing, the aluminum foil or graphite sheet cannot be evenly attached to the casing, thereby affecting the heat dissipation effect
Method used
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[0034] Below in conjunction with accompanying drawing, structural principle and working principle of the present invention are specifically described:
[0035] Please refer to figure 1 , figure 2 , image 3 and Figure 4 . figure 1 It is a flow chart of the casing forming method according to the first embodiment of the present invention. figure 2 It is a schematic diagram of forming the first plastic layer in the casing forming method according to the first embodiment of the present invention. image 3 It is a schematic diagram of the shell forming method according to the first embodiment of the present invention when forming the phase change material microcapsule layer. Figure 4 It is a front view of the structure of the phase change material microcapsule according to the first embodiment of the present invention.
[0036] The first embodiment of the present invention provides a method for forming an electronic device housing, including:
[0037] S1: Form a first pl...
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Abstract
Provided are an electronic device shell structure and a forming method of the electronic device shell structure. The forming method of an electronic device shell comprises the steps that a first plastic layer is formed in an injection molding mode; then, a phase-change material micro-capsule layer is formed on one side of the first plastic layer in an injection molding mode. The electronic device shell structure comprises the first plastic layer and the phase-change material micro-capsule layer arranged on one side of the first plastic layer.
Description
technical field [0001] The present invention relates to an electronic device casing structure and its forming method, in particular to the electronic device casing structure formed by injection molding and its forming method. Background technique [0002] With the advancement of technology and the development of high-tech industries, the market competition for electronic devices (such as notebook computers, portable mobile phones, tablet computers, electronic dictionaries or portable electronic game consoles) is becoming increasingly fierce. In order to meet consumers' performance requirements for electronic devices, the industry has invested considerable research and development costs in improving the performance of electronic devices. Therefore, the performance of electronic devices is also improving day by day. [0003] Due to the improvement of the performance of electronic devices, the heat generated by them is also increasing. In order to dissipate the heat generated...
Claims
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IPC IPC(8): H05K7/20H05K5/00
CPCB29K2995/0012B29C45/1642B29K2105/16B32B27/08B32B27/20B32B3/04B32B2262/101B32B2270/00B29C45/16B32B27/365B29L2009/00B29L2031/3481B32B2250/24B32B2355/02B32B2369/00B32B2457/00B29K2069/00B29K2055/02B29K2105/12Y10T428/1372H05K5/0086B32B3/18
Inventor 郑懿伦林春龙翁志明
Owner INVENTEC PUDONG TECH CORPOARTION