A crystal base for diffusion furnace tube

Abstract

The invention discloses a susceptor for a diffusion furnace tube. The susceptor includes a top base and a bottom base which are configured to be parallel to each other; a plurality of supports arranged vertically between the top base and the bottom base, wherein the supports are arranged at the edges of the top and bottom bases at intervals in a parallel manner; and a plurality of pedestals arranged vertically on the supports at intervals, wherein the pedestals are in sheet shapes and are of quartz material. The quality of the pedestals is easy to be controlled by the susceptor, and the susceptor can effectively control a diffusion layer thickness of a generated wafer product and control the number of particles on the surface of the wafer product in the process of diffusion production, in order to enhance the quality and yield of the product.

Description

technical field [0001] The invention relates to semiconductor diffusion equipment, in particular to a crystal seat for a diffusion furnace tube. Background technique [0002] In the production of semiconductor diffusion, the wafer boat with the wafer is usually supported by the crystal base, and the wafer base is placed in the diffusion furnace tube for diffusion processing. Currently, the commonly used crystal base usually includes multiple bases 31 and multiple quartz crystals. flakes 32, such as figure 1 As shown, the base 31 and the quartz flakes 32 are two independent components, the quartz flakes 32 are placed on the base 31, and each quartz flake 32 can be disassembled and installed at any time. A susceptor uses multiple quartz wafers to control the thickness of the wafer product. The crystal seat of the prior art has the following defects: First, in diffusion production, the base 31 and the quartz flake 32 need to be cleaned with acid after each use, and since the ...

AI Technical Summary

Problems solved by technology

The crystal seat of the prior art has the following defects: firstly, in diffusion production, the base 31 and the quartz flake 32 need to be cleaned with acid after each use, and since the quartz flake 32 is placed on the base 31, they must be separated during cleaning Cleaning, so quartz flakes are often thinned by excessive cleaning and broken by heat during production

And because the quartz flakes are taken randomly, some of the multiple quartz flakes used in one crystal seat may have been pickled only once, and some have been washed many times, so the quality of the quartz flakes is difficult to control , it is difficult to judge whether its quality condition is good before production

Secondly, the quartz surface after pickling is rough and uneven. Since the quartz flake 32 is placed on the base 31, there is friction between the quartz flake 32 and the base 31, and the rough quartz surface may produce detached quartz particles during the diffusion process. Lead to increased particles on the surface of wafer products, resulting in reduced product quality or low product pass rate

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