A backing plate for PCB drilling and manufacturing method thereof
A manufacturing method and backing technology, applied in chemical instruments and methods, applications, household appliances, etc., can solve the problems of PCB board scrap, board delamination, PCB board warpage, etc.
Active Publication Date: 2016-08-24
烟台柳鑫新材料科技有限公司
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- Abstract
- Description
- Claims
- Application Information
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Problems solved by technology
[0005] In view of the above-mentioned deficiencies in the prior art, the object of the present invention is to provide a backing plate for PCB drilling and a manufacturing method thereof, aiming at solving the problem that the backing plate for drilling in the prior art is often used for PCB drilling. The PCB board is warped and the board is delaminated, which leads to the scrapping of the PCB board
Method used
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[0030] In order to make the object, technical solution and advantages of the present invention more clear and definite, the present invention will be further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.
[0031] The invention provides a backing plate for PCB drilling, such as figure 1 As shown, the backing plate includes: a foam core material layer 1 and a first hardness panel layer 2 and a second hardness panel layer 3 respectively arranged on the upper surface and the lower surface of the foam core material layer.
[0032] Such as figure 1 As shown, the pad is designed with the foam core material as the middle material layer and the hardness panel as the surface material layer.
[0033] Specifically, the materials used for the first and second hardness panel layers are high-hardness m...
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Abstract
A backing plate for PCB drilling and a manufacturing method thereof provided by the present invention, the backing plate includes a foam core material layer and a first hardness panel layer and a second hardness panel layer respectively arranged on the upper surface and the lower surface of the foam core material layer Two hardness panel layers. The hardness panel can well suppress the front of the hole, and because the foam core material is arranged in the middle of the backing plate, the foam interlayer of the backing plate has a certain compressive strength, which can not only prevent the PCB board from being damaged due to The slight deformation caused by pressing can also make the drill tip easily cut into powder, and at the same time throw off the drill cuttings adhering to the drill tip to achieve the effect of cleaning the drill tip and provide support for the manufacture of better quality drill holes.
Description
technical field [0001] The invention relates to the technical field of PCB processing and manufacturing, in particular to a backing plate for PCB drilling and a manufacturing method thereof. Background technique [0002] The backing board for PCB drilling is an important auxiliary material in the field of PCB production. The backing boards currently used in the market are mainly thermoformed resin-impregnated laminates or composite wood backing boards. [0003] The above-mentioned backing plate in the prior art often has defects such as warping of the product and layering of the plate when the PCB is drilled, and such a laminate will generate a large amount of powder during the drilling process, which will bond the PCB itself to produce Drilling chips such as resin shavings, glass fiber shavings, and copper shavings are attached to the drill bit, blocking the chip removal groove of the drill needle, making the chip removal poor, resulting in greater wear of the drill needle,...
Claims
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IPC IPC(8): B32B3/12B32B29/06B32B27/04B32B27/02B32B27/34B32B29/02B32B7/12B32B37/12B32B37/10
CPCB32B5/18B32B27/10B32B2255/12B32B2255/26B32B2260/028B32B2260/046B32B2307/54B32B2457/08
Inventor 欧亚周杨柳张伦强刘飞
Owner 烟台柳鑫新材料科技有限公司