Quartz crystal resonator and its packaging process

Abstract

The invention discloses a quartz-crystal resonator. The quartz-crystal resonator comprises an outer shell, a wafer and a pin. The outer shell is composed of a substrate and an upper shell body. The base plate comprises a substrate body and a boss, wherein the substrate body protrudes to form the boss. A step face is formed on the outer side of the boss, and an annular groove is formed in the step face and filled with sealing gum. The upper shell body comprises a cover with the closed upper end, an opening is formed in the lower end of the cover, the lower end of the cover is inserted into the annular groove, and a gap between the inner surface of the annular groove and the outer surface of the lower end of the cover is sealed through sealing gum. The wafer is fixedly installed on the boss of the substrate. The pin is fixed to the substrate through an insulator and electrically connected with the wafer. The invention further discloses a packaging technology of the quartz-crystal resonator. By means of the quartz-crystal resonator and the packaging technology, the good sealing effect can be played, air leakage and the like can be avoided, the vacuum degree can be greatly improved, the air leakage rate can be lowered, and meanwhile stability and firmness are better.

Description

Technical field [0001] The invention relates to a quartz crystal element, in particular to a quartz crystal resonator and its packaging process. Background technique [0002] The quartz crystal resonator is a quartz crystal element formed by a packaging process using a quartz crystal, and a quartz crystal oscillator can be formed by combining a quartz crystal resonator with a semiconductor and a capacitive resistance element. This kind of quartz crystal resonator and oscillator are widely used Used in various electronic products. [0003] Quartz crystal elements (resonators, etc.) generally include an upper shell, a bottom plate, and a chip. The chip is encapsulated in the shell formed by the upper shell and the bottom plate. The inside is in a vacuum state. The internal vacuum is the main factor affecting the performance of the resonator. Some quartz crystal resonators are packaged by welding process, which is prone to problems such as air leakage. Its internal vacuum is low, whi...

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Problems solved by technology

[0003] Quartz crystal components (resonators, etc.) generally include an upper shell, a bottom plate, and a chip. The chip is packaged inside the shell formed by the upper shell and the bottom plate. The interior is in a vacuum state, and the internal vacuum degree is the main factor affecting the performance of the resonator. Now Some quartz crystal resonators are packaged by welding process, which is prone to air leakage and other problems, and its internal vacuum degree is low, resulting in a decrease in its stability. , fixed and sealed by welding. Since tin is easy to melt at high temperature, this welding method cannot use wave soldering and other processes to realize automatic production operations. Therefore, its production efficiency is low, it cannot be mass-produced and processed, and its promotion is limited.

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