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Server and radiating system thereof

一种散热系统、服务器的技术，应用在可提高散热效率的服务器及其散热系统领域，能够解决散热效率不彰等问题

Active Publication Date: 2015-02-11
INVENTEC PUDONG TECH CORPOARTION +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, a blade server usually has several or several motherboards that are adjacent to each other, and the gap between two adjacent motherboards will cause air to flow in the gap instead of flowing between the cooling fins, resulting in Inefficient heat dissipation

Method used

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  • Server and radiating system thereof
  • Server and radiating system thereof
  • Server and radiating system thereof

Examples

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Embodiment Construction

[0031] The manufacturing and application examples of the present invention will be described in detail below. It should be understood that the present invention provides many applicable inventive concepts, and these inventive concepts can be embodied in a wide variety of applications. The specific embodiments discussed below are illustrative only and are not intended to limit the scope of the invention.

[0032] figure 1 is a schematic diagram illustrating the server of the first embodiment of the present invention. As shown in the figure, the server 10 includes a casing 100 , a plurality of processing units 200 and a fan 300 . Wherein, each processing unit 200 of this embodiment is arranged in an array in the casing 100 , and each processing unit 200 is plugged into a slot in the casing 100 in a removable manner. The fan 300 is located inside the casing 100 and is disposed adjacent to the rear end of the casing 100 to discharge heat generated by each processing unit 200 to ...

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Abstract

A server includes a chassis, processing units and an airflow generating device. The processing units are disposed inside the chassis for heat dissipation of the processing units. Each processing unit includes a motherboard, an electric heat source, a heat dissipation fin set and a stopping air bag. The electric heat source is disposed on the motherboard, the heat dissipation fin set is attached to the electric heat source and the stopping air bag including an air inlet opening is located at space between the heat dissipation fin set and one of the processing units which is adjacent to the stopping air bag. When the airflow generating devices are operated, air is blown into the stopping air bag through the air inlet opening so that the stopping air bag is inflated to occupy the space to stop an airflow from flowing through the space.

Description

technical field [0001] The present invention relates to a server and its heat dissipation system, in particular to a server and its heat dissipation system capable of improving heat dissipation efficiency. Background technique [0002] Compared with traditional servers, blade servers obviously save a lot of space, and become the mainstream of new server hosts. The blade server has a complete chassis and is managed in a unified and centralized manner. Although the space of the server mainframe is greatly reduced, it causes the problem of difficult heat dissipation. [0003] Especially with the advancement of semiconductor manufacturing process, chipsets such as the central processing unit (CPU) have progressed from the micron level to the nanometer level, and the number of transistors contained in them is also as high as hundreds of millions. Generates extremely high heat. [0004] In order to solve the heat dissipation problem, heat dissipation fins are generally installe...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20
CPCH05K2007/20527G06F1/20H05K7/20736H05K7/20727
Inventor 赖灵俊
Owner INVENTEC PUDONG TECH CORPOARTION