Heat dissipation module of circuit board
A heat dissipation module and circuit board technology, applied in the direction of circuit heating devices, circuits, printed circuits, etc., can solve the problems of easy generation of test noise, high noise, and inability to dissipate heat in time
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[0040] Such as figure 1 , figure 2 as well as image 3 Shown are the front exploded view, the front perspective view, and the partial exploded view of the upper side of the main circuit board of the first preferred embodiment of the circuit board heat dissipation module of the present invention. As shown in the figure, a circuit board heat dissipation module of this embodiment includes: a main circuit board 1, a first heat sink 2, a plurality of heat conducting fins 31, 32, a pneumatic pump 41, a muffler 42, a Insulating gasket 5 and a second heat sink 6.
[0041] The first heat dissipation base 2 is disposed on the upper side of the main circuit board 1 and includes a first heat dissipation base body 21, a first heat dissipation cover 22 and a plurality of sealing members 23. The first heat sink body 21 has an air inlet 211, an air outlet 212, and an air flow passage 213 communicating with the air inlet 211 and the air outlet 212. The first heat dissipation cover 22 includes a...
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