Network of electronic devices assembled on flexible support and communication method

Abstract

An embodiment of a network of electronic devices is formed on a flexible substrate by a plurality of electronic devices assembled on the flexible substrate. The electronic devices have an embedded antenna for mutual coupling of a wireless type. Each electronic device is formed by a chip or a complex system integrating a transceiver circuit coupled to the embedded antenna and a functional part coupled to the transceiver circuit and including at least one element chosen in the group comprising: a sensor, an actuator, an interface, an electrode, a memory, a control unit, a power-supply unit, a converter, an adapter, a digital circuit, an analog circuit, an RF circuit, a microelectromechanical system, an electrode, a well, a cell, a container for liquids. The flexible support may be a substrate of plastic material that incorporates the electronic devices or a garment having smart buttons that house the electronic devices.

Description

technical field [0001] The present invention relates to a method of networking and communication of electronic devices assembled on a flexible support. Background technique [0002] As we all know, most of the current electronic devices are formed in silicon chips through the excellent characteristics of semiconductor materials. One limitation of silicon, however, is its lack of flexibility, making it unusable in some applications. For example, silicon is not suitable for use on fabrics or other substrates due to the folding it undergoes during use. On the other hand, alternative materials such as conducting or semiconducting polymers are currently being investigated, which have poor electrical properties compared to silicon and are therefore not yet viable alternatives. [0003] Therefore, it is desirable to provide solutions that enable circuits or networks of flexible electronic devices. However, attachment of conventional types of electronic devices to flexible suppor...

AI Technical Summary

Problems solved by technology

Another limitation lies in the number of bending or folding events the support can withstand

For example, some existing connectors only allow a single folding operation (e.g. during assembly), and their spatial arrangement cannot be subsequently modified

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