Copper strip base material production system for lead frame

Abstract

The invention discloses a copper strip base material production system for a lead frame. The copper strip base material production system comprises a furnace body, a quality enhancer, a feeding assembly, a feeding hole opening and closing assembly, a protective gas conveying assembly and an anti-oxidation raw material conveying assembly, wherein a deslagging port is formed in the lower part of the furnace body, a feeding hole is formed in the upper part of the furnace body, an accommodating chamber is arranged at the top of the furnace body, a quality enhancer suspension system is arranged inside the furnace body, and the suspension system is connected with a controller through a connecting line; the quality enhancer is arranged on the suspension system inside the accommodating chamber in a hanging mode; the feeding assembly comprises a car body and a feeding track, the car body is provided with a conveyor, and a baffle is arranged at the front part of the car body; the feeding hole opening and closing assembly comprises a loading door and a hanging belt for pulling the loading door, and the hanging belt is connected with a speed reduction motor; the protective gas conveying assembly comprises an air chamber communicated with the accommodating chamber; the anti-oxidation raw material conveying assembly comprises a containing chamber, a thruster and a push rod, the containing chamber is communicated with the accommodating chamber, one end of the push rod is connected with the thruster in a transmission mode, and the other end of the push rod is positioned inside the containing chamber. The copper strip base material production system has the advantages of simple structure, easy implementation and control, high degree of automation, convenient control for product quality, and the like.

Description

[0001] technical field [0002] The invention belongs to the field of copper deep processing, in particular to a lead frame copper strip substrate production system. Background technique [0003] Lead frame copper strip is the key material of integrated circuits, showing a rapid growth trend in recent years, and the market demand is very large. At present, the domestic self-sufficiency rate of discrete device copper strips has increased, while highly integrated lead frame copper strips still need to be imported. [0004] The reason is that the strength and conductivity of domestic copper strips cannot meet the requirements. In the case of meeting the requirements of electrical conductivity, how to improve its physical properties such as strength is a problem that needs to be solved at present. [0005] In the existing process, the copper strip has high oxygen content, large amount of slag, and low quality, which have become the main factors restricting production. Conten...

AI Technical Summary

Problems solved by technology

[0005] In the existing process, the copper strip has high oxygen content, large amount of slag, and low quality, which have become the main factors restricting production

Images