Tire pressure monitoring system package structure and package method thereof
A tire pressure monitoring system and packaging structure technology, applied in the direction of electrical components, electric solid devices, circuits, etc., can solve the problems that cannot meet the higher requirements of automobile tire pressure monitoring, the tire pressure monitoring system is bulky, and the installation process is time-consuming and laborious. , to achieve the effect of improving production efficiency, saving time and effort in the installation process, and simple processing procedures
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Example Embodiment
[0034] The technical solutions of the present invention will be further described below in conjunction with the drawings and specific implementations.
[0035] Figure 1 to Figure 3 It is a schematic structural diagram of the packaging structure of the tire pressure monitoring system provided by the specific embodiment of the present invention. A packaging structure of a tire pressure monitoring system, comprising a substrate 4 with a top layer and a bottom layer. The sensor 1 and the control chip 2 are respectively adhered to the top layer of the substrate 4 and fixed by fixing parts. The discrete components 3 are also mounted on the substrate 4 On the top layer of the sensor 1, the sensor 1 is covered with silicone, and all the components provided on the substrate 4 are encapsulated by encapsulating materials. The sensor 1 is usually a microelectromechanical (MEMS) sensor (including pressure and acceleration sensors).
[0036] Specifically, the substrate 4 is preferably a high h...
PUM
Property | Measurement | Unit |
---|---|---|
Thermal expansion coefficient | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap