Tire pressure monitoring system package structure and package method thereof

Abstract

The invention discloses a tire pressure monitoring system package structure and a package method thereof and belongs to the technical field of integrated circuit package. The structure and the method are designed for solving the problem that an existing device is large in size, heavy and inconvenient to install on an automobile tire. The package structure comprises a substrate with a top layer and a bottom layer, a sensor and a control chip are adhered to the top layer of the substrate and respectively fixed through fixing parts, discrete components are surface-mounted on the top layer of the substrate, the sensor is wrapped with silica gel, and all the components arranged on the substrate are packaged through envelope materials. The tire pressure monitoring system package structure is small in size, lightweight and stable in performance, the package method is simple in process and convenient, and reliability in use under the severe environment can be guaranteed.

Description

technical field [0001] The invention relates to the technical field of integrated circuit packaging, in particular to a packaging structure of a tire pressure monitoring system and a packaging method thereof. Background technique [0002] Tire Pressure Monitoring System TPMS (Tire Pressure Monitoring System) is an ideal tool for real-time monitoring of changes in the air pressure in automobile tires. In case of low pressure, the alarm will be issued in time to ensure driving safety. In addition, through the real-time monitoring of the tire pressure monitoring system, when the tire pressure becomes low, it can be operated in time, thereby reducing the fuel consumption loss caused by driving when the tire pressure is low, and prolonging the use of tires life. The tire pressure monitoring system realizes its monitoring function by integrating semiconductor devices such as sensors, control chips, and discrete components. [0003] In the existing tire pressure monitoring system...

AI Technical Summary

Problems solved by technology

[0003] In the existing tire pressure monitoring system, the sensor and the control chip are bonded on a special wire frame, and the metal pins are bound to the outside of the wire frame. The special wire frame is not only bulky but also very heavy. The size, shape and structure of the corresponding molds and wireframes are produced. The production process is complex and costly, and the development cycle is long. In addition, the existing tire pressure monitoring system is too bulky to achieve a higher degree of integration and cannot meet the needs of automobile tire pressure monitoring. The higher demand, and the huge volume and heavy weight make it difficult to install on the tire, and the installation process is time-consuming and laborious

Images