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Solder paste printing equipment and method for detecting hole blocking of printing stencil

A solder paste printing and equipment technology, applied in general parts of printing machinery, printing, printing machines, etc., can solve problems such as increasing production costs, affecting production efficiency, and blocking mesh holes, increasing production efficiency and reducing the probability of occurrence. , the effect of improving quality

Active Publication Date: 2016-06-29
GKG PRECISION MACHINE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Solder paste printing machine often has the problem of mesh clogging during printing, and mesh clogging will seriously affect the quality of solder paste printing
At present, judging whether the mesh is blocked usually depends on the inspection of the operator, which affects the production efficiency and increases the production cost of the enterprise.

Method used

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  • Solder paste printing equipment and method for detecting hole blocking of printing stencil
  • Solder paste printing equipment and method for detecting hole blocking of printing stencil
  • Solder paste printing equipment and method for detecting hole blocking of printing stencil

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Embodiment Construction

[0033] In order to make the purpose, features and advantages of the present invention more obvious and understandable, the technical solutions protected by the present invention will be clearly and completely described below using specific embodiments and accompanying drawings. Obviously, the implementation described below Examples are only some embodiments of the present invention, but not all embodiments. Based on the embodiments in this patent, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of this patent.

[0034] The invention provides a solder paste printing equipment, please refer to figure 1 and figure 2 As shown, it includes: an image acquisition device 2 for collecting the mesh image of the PCB template 1 after printing, located in the image acquisition area, connected with the image acquisition device 2, an illumination device 3 for providing a light source for the acquisition image,...

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PUM

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Abstract

The invention discloses solder paste printing equipment and a method for detecting printing stencil blocked holes. The solder paste printing equipment comprises an image capture device for capturing PCB (printed circuit board) template mesh images after printing, a lighting device arranged in an image capture area, connected with the image capture device and used for providing light sources for image capture, and a microprocessor connected with the image capture device, used for receiving images captured by the image capture device and judging whether the PCB template mesh is blocked or not after a printing through comparison with a standard PCB template mesh image. In a process of the solder paste printing, a stencil PCB template mesh blocked holes detection function is added, PCB template mesh blocked holes can be detected, occurrence probability of the solder paste printing defects is reduced, PCB template printing quality is improved, and production efficiency is also improved.

Description

technical field [0001] The invention relates to solder paste printing equipment, in particular to a solder paste printing equipment with the function of detecting hole blocking of a printing stencil and a method for detecting hole blocking of a printing stencil. Background technique [0002] The electronic assembly manufacturing industry has become a very important part of the modern manufacturing industry, and the assembly and processing of circuit boards and PCB boards is a vital link in the electronic manufacturing industry. As the core technology of circuit board assembly and processing, surface mount technology is currently developing rapidly in the direction of miniaturization of parts, increasing area density, and continuous improvement of mounting accuracy, so as to meet the requirements of miniaturization, high frequency, and high transmission rate of electronic products. Require. Correspondingly, the requirements for the solder paste printing process in SMT (Surfa...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B41F15/08B41F33/00
Inventor 邱国良
Owner GKG PRECISION MACHINE