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Electronic product reliability accelerated test method based on failure physics

An electronic product and accelerated test technology, which is applied in the direction of electrical digital data processing, special data processing applications, instruments, etc., can solve the problems of large error in test results, low model accuracy, and inability to consider stress transfer effects, etc.

Active Publication Date: 2015-03-04
CHINA AERO POLYTECH ESTAB
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Problems solved by technology

However, since these models are all statistical acceleration models based on the failure mechanism of components, the acceleration model cannot consider the transfer of stress in the product structure, and the accuracy of the model is relatively low, resulting in large errors in test results.

Method used

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  • Electronic product reliability accelerated test method based on failure physics
  • Electronic product reliability accelerated test method based on failure physics
  • Electronic product reliability accelerated test method based on failure physics

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Embodiment Construction

[0033] The present invention will be described in further detail below. A method for accelerated reliability testing of electronic products based on fault physics, characterized in that: the steps for accelerating the reliability testing of electronic products are as follows:

[0034]1. Build digital prototype models of electronic products: digital prototype models refer to two-dimensional digital prototype models or three-dimensional digital prototype models, and electronic products include chassis, brackets, modules, circuit boards and components;

[0035] 2. Analysis of thermal stress state and vibration stress state: Use finite element simulation analysis software to analyze the thermal stress state and vibration stress state of electronic products under load conditions. The load conditions refer to environmental loads and working loads;

[0036] 3. Determine the failure mechanism of electronic products: According to the thermal stress state and vibration stress state of e...

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Abstract

The invention belongs to an electronic product reliability technology and relates to an electronic product reliability accelerated test method based on failure physics. The electronic product reliability accelerated test method is characterized by comprising the following steps: building a digital prototype model of an electronic product; analyzing a thermal stress state and a vibration stress state; determining a failure mechanism of the electronic product; determining a failure physics model of the electronic product; providing temperature conditions for reliability accelerated test; calculating accelerated test time; calculating the vibration conditions of the reliability accelerated test; evaluating test implementation and test results. The electronic product reliability accelerated test method provided by the invention has the benefits that the transfer effect of stress in a product structure can be considered, the accuracy of the model is improved, and further, the test result accuracy is improved.

Description

technical field [0001] The invention belongs to the reliability test technology of electronic products, and relates to an accelerated test method for the reliability of electronic products based on fault physics. Background technique [0002] Modern high-tech equipment has high requirements for reliability. Among them, electronic / electromechanical / photoelectric products that play a key role are developing in the direction of digitalization, miniaturization, densification, multi-function and complexity, and their reliability requirements are also higher. The mean time between failures (MTBF) of many products is required to reach thousands of hours or even tens of thousands of hours. According to the traditional test technology, the test time should be at least 1.1 times the required value. It takes several months or even years to complete the test when a set of test samples is used; and if multiple sets of test samples are invested, the cost of the samples is also unbearable....

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F17/50
Inventor 任占勇王昕陈新孙瑞锋李想王欣王礼沅杜鑫
Owner CHINA AERO POLYTECH ESTAB
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