Packaging method of hollow packaging LED (light emitting diode) display module

A display module and packaging method technology, which is applied in the field of LED light sources, can solve problems such as increasing enterprise costs, bad disassembly, and affecting efficiency, and achieve the effects of reducing labor costs, improving assembly efficiency, and reducing production costs

Inactive Publication Date: 2015-03-04
JIANGSU WENRUN OPTOELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Using the existing packaging method, every time a product is made, it is necessary to customize a mold that matches the size of the product, because some customers may not have a large order for products, and each custom mold will increase the cost of the enterprise, and some small enterprises will use manual The way of ironing and pressing consumes manpower and affects the efficiency. If the pressing is not in place, it will also cause light leakage of the product
It is more troublesome to disassemble the product after pressing and ironing if it is found to be defective.

Method used

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  • Packaging method of hollow packaging LED (light emitting diode) display module
  • Packaging method of hollow packaging LED (light emitting diode) display module

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Embodiment Construction

[0022] Below in conjunction with accompanying drawing, technical scheme of the present invention is described in further detail:

[0023] Such as figure 1 Shown is a schematic diagram of an existing encapsulation method, figure 1 (a) is a module that matches the air-sealed LED display module, figure 1 (b) Air-sealed LED display module. The packaging method of the existing air-sealed LED display module is to use the method of pressing the positioning column 4 with the mold, and after inserting the positioning hole in the PCB board 3 into the positioning column 4 in the plastic case, the part beyond the PCB board 3 can be used. The module flattens it to achieve the purpose of combining with the PCB board 3 .

[0024] In order to save costs and improve efficiency, a new type of packaging method was invented, which can effectively reduce costs and facilitate disassembly when defects are found. A packaging method for an air-sealed LED display module of the present invention com...

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Abstract

The invention discloses a packaging method of a hollow packaging LED (light emitting diode) display module. The packaging method comprises the following steps of 1, forming n holes in a plastic casing, wherein the height of each hole is flush with a module window in the plastic casing, and n is an integer and is greater than 1; 2, arranging two positioning holes for fixing the position of a PCB (printed circuit board) on the plastic casing; 3, sleeving the PCB in the positioning column, and enabling a fixing part to penetrate through the PCB and embed into a hole of the plastic casing, so as to fix the PCB and the plastic casing. Compared with the packaging method of the traditional hollow packaging product, the packaging method has the advantages that the cost is reduced, the efficiency is improved, the possibility of light leakage caused by improper die pressure of the hollow packaging LED display module is reduced, and the detachment, replacement and maintenance are very convenient.

Description

technical field [0001] The invention relates to the technical field of LED light sources, in particular to a packaging method for an air-sealed LED display module. Background technique [0002] At present, the packaging method of the existing air-sealed digital tube LED display module is to use the method of pressing the positioning column with the mold, and after the positioning hole in the PCB board is inserted into the positioning column in the plastic case, the part beyond the PCB board can be used. The module flattens it to achieve the purpose of combining with the PCB board. Using the existing packaging method, every time a product is made, it is necessary to customize a mold that matches the size of the product, because some customers may not have a large order for products, and each custom mold will increase the cost of the enterprise, and some small enterprises will use manual The hot pressing method consumes manpower and affects the efficiency. Insufficient pressi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G09F9/33
CPCG09F9/33
Inventor 秦超
Owner JIANGSU WENRUN OPTOELECTRONICS
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