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Adapter board and its manufacturing method, packaging structure

A technology of transfer board and wiring structure, which is applied in semiconductor/solid-state device manufacturing, electrical components, electric solid-state devices, etc., and can solve problems such as low fracture strength of through-glass holes, parasitic capacitance, fragmentation, and cracks

Active Publication Date: 2017-12-01
TSINGHUA UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The tapered hole drilled on the board body of the adapter board has a larger diameter of the plane end than the tip, this structure makes the filled conductor occupy a larger area on the side of the plane end of the tapered hole, thus limiting the transfer rate. The number of integrated devices on the board
Moreover, the existing adapter plate is mainly made of glass and silicon, and the fracture strength of the glass through hole is low, which is easy to cause thermomechanical stress problems such as fragmentation and cracks
In TSVs, the transmission channel will generate electrical problems such as parasitic capacitance, inductance, and leakage current

Method used

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  • Adapter board and its manufacturing method, packaging structure
  • Adapter board and its manufacturing method, packaging structure
  • Adapter board and its manufacturing method, packaging structure

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Embodiment Construction

[0025] Specific embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings. It should be understood that the specific embodiments described here are only used to illustrate and explain the present invention, and are not intended to limit the present invention.

[0026] Figure 1a and Figure 1b It is a schematic diagram of the adapter plate provided by the two embodiments of the present invention. Such as Figure 1a In the illustrated embodiment, the interposer board 100 may include a board body 101 , an insulator 102 , a conductor 103 , and a first wiring structure 104 a and a second wiring structure 104 b. Wherein, the plate body 101 has a first surface 101 a and a second surface 101 b opposite to each other, and a frustum-shaped through hole 101 c penetrating through the plate body 101 may be formed between the first surface 101 a and the second surface 101 b. The insulator 102 may be filled in the frustum-shaped t...

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Abstract

The invention discloses an adapter board, a manufacturing method and a packaging structure thereof. The adapter board includes: a plate body with opposite first and second surfaces, and a frustum-shaped through hole penetrating through the plate body is formed between the first surface and the second surface; an insulator is filled in the frustum-shaped through hole In the hole, a cylindrical through hole penetrating the board body is formed; the conductor is filled in the cylindrical through hole; and the first wiring structure and the second wiring structure are respectively arranged on the first surface and the second surface of the board body on, and electrically connected to the conductor. In the adapter board provided by the present invention, the integration density of devices on the adapter board is improved, thereby increasing the integration density of the entire package structure, and reducing the thermal expansion coefficient mismatch between the conductor and the board body in the glass adapter board. The thermal stress problem of the silicon interposer avoids the electrical problems generated in the silicon interposer, thus enhancing the mechanical and electrical reliability of the interposer.

Description

technical field [0001] The invention relates to the field of packaging, in particular to an adapter board, a manufacturing method thereof, and a packaging structure. Background technique [0002] The 3D system-in-package utilizes chips stacked on top of each other, thereby realizing efficient interconnection of different chips in the vertical direction. The interposer plays a connecting role in the three-dimensional system integration, enabling the redistribution of signal output ports. The production of the adapter board is mainly by punching holes in the board body and filling the conductors, so as to obtain the vertical transmission channel of the signal. The tapered hole drilled on the board body of the adapter board has a larger diameter of the plane end than the tip, this structure makes the filled conductor occupy a larger area on the side of the plane end of the tapered hole, thus limiting the transfer rate. The number of integrated devices on the board. Moreover,...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/48H01L23/48H01L21/60
Inventor 蔡坚魏体伟王璐王谦刘子玉
Owner TSINGHUA UNIV
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