Insulating Resin Composition For Printed Circuit Board And Products Manufactured By Using The Same
A technology of printed circuit boards and insulating resins, which is applied in the fields of printed circuit manufacturing, printed circuits, printed circuits, etc., and can solve the problems of not improving the thermal expansion coefficient and glass transition temperature performance of printed circuit boards
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0098] 4 g of the low polymer of benzyl maleimide and 20 g of the liquid crystal low polymer prepared in the above preparation example were mixed into 28.12 g of N,N'-dimethylacetamide (DMAc) solvent, followed by stirring for 1 hour. 16 g of 4-functional naphthyl epoxy resin bis(2,7-bis(2,3-epoxypropoxy))binaphthyl methane was added, followed by stirring for 2 hours. Then, 0.16 g of dicyandiamide (DICY) and 0.1 g of azobisisobutyronitrile (AIBN) were added thereto, followed by stirring for 1 hour to prepare a completely dissolved resin composition. An appropriate amount of the resin composition was poured on the shiny surface of the copper foil, and a film with a thickness of about 150 um was obtained by a film caster used in a laboratory. The membrane was first dried in an oven at about 80°C for 30 minutes to remove volatile solvents. The film was then dried again at about 120° C. for 60 minutes to obtain a film in the B stage. Through the temperature of about 220 ℃ and 30k...
Embodiment 2
[0100] 7.5 g of the low polymer of benzyl maleimide and 15 g of the liquid crystal low polymer prepared in the above preparation example were mixed into 30.23 g of N,N'-dimethylacetamide (DMAc) solvent, followed by stirring for 1 hour. 15 g of 4-functional naphthyl epoxy resin bis(2,7-bis(2,3-epoxypropoxy))binaphthyl methane was added, followed by stirring for 2 hours. Then, 0.15 g of dicyandiamide (DICY) and 0.1875 g of azobisisobutyronitrile (AIBN) were added thereto, followed by stirring for 1 hour to prepare a completely dissolved resin composition. Pour an appropriate amount of the resin composition on the shiny surface of the copper foil, and obtain a film with a thickness of about 150 um by a film coater used in the laboratory. The membrane was first dried in an oven at about 80°C for 30 minutes to remove volatile solvents. The film was then dried again at about 120° C. for 60 minutes to obtain a film in the B stage. Through the temperature of about 220 ℃ and 30kgf / cm...
Embodiment 3
[0102] 12 g of the low polymer of benzyl maleimide and 12 g of the liquid crystal low polymer prepared in the above preparation example were mixed into 36.36 g of N,N'-dimethylacetamide (DMAc) solvent, followed by stirring for 1 hour. 16 g of 4-functional naphthyl epoxy resin bis(2,7-bis(2,3-epoxypropoxy))binaphthyl methane was added, followed by stirring for 2 hours. Then, 0.16 g of dicyandiamide (DICY) and 0.3 g of azobisisobutyronitrile (AIBN) were added thereto, followed by stirring for 1 hour to prepare a completely dissolved resin composition. Pour an appropriate amount of the resin composition on the shiny surface of the copper foil, and obtain a film with a thickness of about 150 um by a film coater used in the laboratory. The membrane was first dried in an oven at about 80°C for 30 minutes to remove volatile solvents. The film was then dried again at about 120°C for 60 minutes to obtain a film in the B stage. Through the temperature of about 220 ℃ and 30kgf / cm 2 Ho...
PUM
Login to View More Abstract
Description
Claims
Application Information
Login to View More