Light emitting diode
A technology of light-emitting diodes and light-emitting chips, which is applied in the field of diodes, can solve the problems of limited electrode wiring area, weak wiring, and affecting product yield, so as to prevent weak wiring, improve yield, and area area increased effect
Inactive Publication Date: 2015-03-18
山东丽欧照明科技有限公司
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- Abstract
- Description
- Claims
- Application Information
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Problems solved by technology
However, due to the large number of chips in the housing, the number of wires that need to be bonded is correspondingly large, and the area available for wire bonding on the electrode is limited, resulting in the occurrence of loose wires during the wire bonding process. thereby affecting product yield
Method used
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Embodiment Construction
[0015] see figure 1 and 3 , shows a light emitting diode 10 according to an embodiment of the invention. The light-emitting diode 10 includes a casing 20, a first electrode 32 and a second electrode 34 inserted in the casing 20, a first light-emitting chip 50 mounted on the first electrode 32, and a first light-emitting chip 50 mounted on the second electrode 34. A second light-emitting chip 60 on the top, wires 70 connecting the first light-emitting chip 50 and the second light-emitting chip 60 , and a package body 80 covering the first light-emitting chip 50 and the second light-emitting chip 60 .
[0016] The casing 20 includes a base 22 and a reflective cup 24 formed on the base 22 . The casing 20 can be integrally formed of plastic material, or the base 22 and the reflective cup 24 can be formed separately first, and then the reflective cup 24 and the base 22 can be combined. The reflective cup 24 is located above the base 22 and has a cavity in the middle of its top s...
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The invention discloses a light emitting diode, which comprises a shell, a first electrode, a second electrode, a first light emitting chip, a second light emitting chip, a wire and a packaging body, wherein the first electrode and the second electrode are separated via an insulated belt; the tail end of the first electrode extends towards the second electrode and a suspended first routing area is formed; the tail end of the second electrode extends towards the first electrode and a suspended second routing area is formed; the first light emitting chip and the first electrode are electrically connected and are electrically connected onto the second routing area via the wire; and the first light emitting chip and the first electrode are electrically connected and are electrically connected onto the second routing area via the wire; the second light emitting chip and the second electrode are electrically connected and are electrically connected onto the first routing area via the wire. The routing process of the light emitting diode is more reliable, and a high product yield is thus acquired.
Description
technical field [0001] The invention relates to a diode, in particular to a light emitting diode. Background technique [0002] As an emerging light source, light emitting diodes have been widely used in various applications. In order to improve the luminance, the industry has designed a light-emitting diode integrated with multiple chips, so that each chip emits light at the same time to output higher light intensity. [0003] Existing multi-chip LEDs usually consist of a housing, two electrodes embedded in the housing, a plurality of chips mounted on the electrodes, and a package for encapsulating the chips. Each chip is connected with two electrodes by wire bonding. However, due to the large number of chips in the housing, the number of wires that need to be bonded is correspondingly large, and the area available for wire bonding on the electrode is limited, resulting in the occurrence of loose wires during the wire bonding process. And then affect the product yield. ...
Claims
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Login to View More IPC IPC(8): H01L33/48H01L33/62
CPCH01L33/48H01L33/62
Inventor 胡必强许时渊
Owner 山东丽欧照明科技有限公司