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Copper alloy plate and electronic components for large current and electronic components for heat dissipation provided with the same

A copper alloy plate, using electronic technology, applied in the direction of electrical components, metal/alloy conductors, circuits, etc., to achieve the effects of high conductivity, high strength, and excellent drawing processability

Active Publication Date: 2017-06-20
JX NIPPON MINING & METALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0007] However, conventional copper alloys obtained by adding Zr or Ti to Cu (hereinafter referred to as Cu-Zr-Ti-based alloys) have high strength and heat conduction properties, but they are difficult to obtain in terms of required bendability or drawing workability. In some cases it is not possible to satisfy both

Method used

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  • Copper alloy plate and electronic components for large current and electronic components for heat dissipation provided with the same

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Embodiment

[0048] Examples of the present invention are shown below together with comparative examples. However, these examples are provided for better understanding of the present invention and its advantages, and are not intended to limit the invention.

[0049] After adding alloying elements to the molten copper, it is cast into an ingot with a thickness of 200 mm. The ingot was heated at 950° C. for 3 hours, and hot rolled to form a 15 mm thick plate. After grinding and removing scale on the surface of the hot-rolled sheet with a grinder, annealing and cold-rolling are repeated, and the final cold-rolling is finished to a given product thickness. Finally, a continuous annealing furnace is used for stress relief annealing.

[0050] The annealing (final recrystallization annealing) before final cold rolling used a batch furnace, the heating time was set to 5 hours, and the temperature in the furnace was adjusted within the range of 300 to 700° C. to change the crystal grain size and e...

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Abstract

Discloseda are a copper alloy plate and a large-current electronic part therewith, and an electronic part for heat dissipation. The invention. The present invention provides a combination of high strength, high conductivity and excellent workability of the copper alloy.The copper alloy sheet of the present invention contains a total of one or two selected from 0.01 to 0.50% by mass of Zr and Ti, the balance comprises copper and unavoidable impurities. The copper alloy sheet having more than 70% IACS electrical conductivity, and more than 350MPa 0.2% proof stress, W bending test based on the obtained MBR / t<=2.0 or less, and according to the rolling parallel, right angle, 45 DEG C Lankford value in each direction r0, r90, r45, to (r0 + r90 + 2*r45) / 4 anisotropy defined thickness is 1.2 or more.

Description

technical field [0001] The present invention relates to a copper alloy with excellent heat dissipation, electrical conductivity and deep-drawing properties. Specifically, it relates to a copper alloy suitable for electronic devices such as terminals, connectors, relays, switches, sockets, bus bars, and lead frames. For component applications, it is especially suitable for heat-dissipating components and high-current components used in smartphones and personal computers. Background technique [0002] In electrical / electronic devices such as smartphones, tablets, and personal computers, components for obtaining electrical connections, such as terminals, connectors, switches, sockets, relays, bus bars, and lead frames, are incorporated. [0003] In recent years, with the miniaturization of smartphones, tablet PCs, and personal computers, heat storage tends to increase when power is applied to liquid crystal components and IC chips in electrical / electronic equipment. Since the ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C22C9/00H01B1/02H01B5/02H05K7/20
CPCC22C9/00C22F1/08H01B1/026H05K7/20
Inventor 柿谷明宏
Owner JX NIPPON MINING & METALS CORP