Flip Chip Package Structure

Abstract

A flip-chip packaging structure, including a flexible circuit board and a chip fixed on the flexible circuit board, the flexible circuit board is provided with an electrical functional area and a non-electrical functional area adjacent to the electrical functional area, and the chip is installed In the electrical functional area to be electrically connected to the flexible circuit board, the flexible circuit board is provided with an alignment marker located in the non-electrical functional area and an alignment marker located near the alignment marker A support member, the height of the support member is greater than the height of the alignment marker. Such setting can improve the identification rate of the production machine for the alignment markers during the production process and reduce the abnormal rate of the product.

Description

technical field [0001] The invention relates to the field of electronic semiconductors, in particular to a semiconductor flip-chip packaging structure. Background technique [0002] At present, the bonding (bonding) machine of the panel factory needs to use the alignment mark (alignment mark) on the flip-chip package flexible circuit board as the alignment reference point to achieve the purpose of automatic identification of alignment production. Moreover, the ability of the machine to recognize images is limited. Therefore, the quality of the alignment mark directly affects the machine identification ability and production efficiency. At present, many alignment marks (alignment marks) on the tape (flip-chip package flexible circuit board) used for automatic identification of machines cannot avoid contact or friction with their packaging materials or related parts of the production machine during the production process or transportation process. As a result, the machine ca...

AI Technical Summary

Problems solved by technology

At present, many alignment marks (alignment marks) on the tape (flip-chip package flexible circuit board) used for automatic identification of machines cannot avoid contact or friction with their packaging materials or related parts of the production machine during the production process or transportation process. As a result, the machine cannot automatically identify the alignment mark (alignment mark), and the alarm is often reported due to abnormal product quality during production, which increases the frequency of operators manually adjusting the machine identification, thereby reducing the driving rate of the machine and production line operations. Efficiency, consumes a lot of human resources

Images