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Electrostatic adsorption production method for reinforce panels

A technology of electrostatic adsorption and production methods, which is applied in the direction of electrical components, printed circuits, printed circuit manufacturing, etc., and can solve the problems of polluting the bare die of the reinforcing sheet, increasing the process of the reinforcing sheet, and increasing the cost.

Inactive Publication Date: 2015-03-25
SUZHOU MIDAS PRECISION ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this processing method needs to be bonded to the weak mucous membrane when punching out the bare reinforcement sheet and laying it out, and the glue on the weak mucous membrane will contaminate the bare reinforcement sheet. Chip dies are cleaned before they can be bonded with thermoset adhesive
Due to the pollution caused by the weak mucous membrane, the production of the reinforcement sheet increases the process and increases the cost

Method used

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  • Electrostatic adsorption production method for reinforce panels
  • Electrostatic adsorption production method for reinforce panels
  • Electrostatic adsorption production method for reinforce panels

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Embodiment Construction

[0015] The specific implementation manners of the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0016] like Figure 1 to Figure 4 As shown, the upper mold 1 is provided with: forming knives 4, and the reinforcing sheet forming knives can be one or more combinations.

[0017] The jig 10 is provided with: a positioning column 11, a reinforcing sheet placement hole 12, and a magnet 8; the magnet 8 is located below the reinforcing sheet placement hole 12, and its function is to absorb the steel sheet 5, so as to facilitate tearing off the static film 7.

[0018] The thermosetting adhesive 9 is regular typesetting, and is consistent with the typesetting of the steel sheet 5; there are positioning holes 12 on the thermosetting adhesive carrier tape, which match with the p...

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PUM

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Abstract

The invention discloses an electrostatic adsorption production method for reinforce panels, and relates to the technical field of machining of flexible circuit boards. The method comprises the steps that a molding knife (4) is mounted on an upper die (1) of a forming machine, and a steel belt (3) is conveyed to the forming machine and punched; the reinforce panels (5) are punched on the steel belt (3) through the molding knife (4), the reinforce panels (5) fall onto an electrostatic film (7) below and are regularly arranged, and the electrostatic film (7) is continuously wound.

Description

technical field [0001] The invention relates to the technical field of flexible circuit board processing, in particular to an electrostatic adsorption production method of a reinforcing sheet. Background technique [0002] At present, typesetting batch production is often used in the production of reinforcement sheets, that is, the regular typesetting bare reinforcement sheets are bonded with the same regular typesetting thermosetting adhesive through a jig, and then heated and formed. Compared with manually placing the reinforcement sheet bare one by one Chip to fixture is more convenient and efficient. However, this processing method needs to be bonded to the weak mucous membrane first when punching out the bare reinforcement sheet and laying it out, and the glue on the weak mucous membrane will contaminate the bare reinforcement sheet. Chip dies are cleaned before they can be bonded with thermoset adhesive. Due to the pollution caused by the weak mucous membrane, the pr...

Claims

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Application Information

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IPC IPC(8): H05K3/00
CPCH05K1/0278
Inventor 王中飞
Owner SUZHOU MIDAS PRECISION ELECTRONICS
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