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Mold release film

A release film and release layer technology, applied in film/sheet-like adhesives, electronic equipment, applications, etc., can solve the problems of peelability (decreased release properties, decreased pressure lamination workability, etc.)

Inactive Publication Date: 2015-04-08
SUMITOMO BAKELITE CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, in the release film described in Patent Document 1, when the embedding property of the release film is sufficiently ensured, the peelability (release property) between the release film and the object to be processed decreases.
Therefore, the workability of pressure lamination may be reduced

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0133] (1) Raw materials for the first release layer and the second release layer

[0134] First, SPS resin (manufactured by Idemitsu Kosan Co., Ltd., XAREC S104) was prepared as raw materials for the first release layer and the second release layer, respectively.

[0135] (2) The raw materials of the base

[0136] In addition, the following resins were prepared as raw materials of the base layer.

[0137] ・SPS resin (manufactured by Idemitsu Kosan Co., Ltd., XAREC S104) 20 parts by mass

[0138] 80 parts by mass of polyolefin resin

[0139] In addition, polyolefin resin is a mixture of several resins, and the content is as follows. In the following description and Tables 1 and 2, the ethylene-methyl methacrylate copolymer is indicated as EMMA, the ethylene-styrene copolymer is indicated as AD, and the polypropylene is indicated as PP.

[0140] EMMA (manufactured by Sumitomo Chemical Co., Ltd., ACRYFT WD106) 30 parts by mass

[0141] AD (manufactured by Mitsubishi Chemica...

Embodiment 2～9

[0149] As shown in Table 1, except having changed the layer constitution and manufacturing conditions of the release film, it carried out similarly to Example 1, respectively, and manufactured the release film. In addition, in some examples, N,N',N"-tris[2-methylcyclohexyl]-1,2,3-propanetricarboxamide was used as a nucleating agent.

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Abstract

The present invention provides a mold release film having both mold release properties and embedding performance. The mold release film (1) according to the present invention comprises: a base layer (2) which comprises a polyolefin resin and a polystyrene resin having a syndiotactic structure; and a first mold release layer (3) which is arranged on the upper surface of the base layer (2) and is composed of a resin material containing a polystyrene resin having a syndiotactic structure as the main component. The mold release film (1) has a tensile storage elastic modulus (E') of 1.0 × 106 to 5.0 × 108 Pa at 120°C and 1.0 × 107 to 1.0 × 109 Pa at 170°C as measured by a test method in accordance with JIS K 7244 under such conditions that the length of a test piece is 40 mm, the width of the test piece is 4 mm, the length of the test piece between clamps is 20 mm, the measurement starting temperature is 25°C, the measurement termination temperature is 250°C, the temperature rising rate is 5°C / min, and the measurement frequency is 1 Hz.

Description

technical field [0001] The present invention relates to release films. [0002] this application claims priority based on Japanese Patent Application No. 2012-158584 for which it applied to Japan on July 17, 2012, and uses the content here. Background technique [0003] For example, a cover film is provided in a flexible printed wiring board (hereinafter also referred to as FPC) to cover the electrical wiring formed on the surface of an insulating substrate such as a polyimide resin film, thereby enabling the protection of the electrical wiring. insulation. The cover film can be disposed by pressure lamination on an insulating base material. [0004] The pressure lamination method is a method of crimping the cover film on the insulating substrate and the electrical wiring by contacting the hot plate. In order to easily separate the hot plate from the cover film and the insulating base material after crimping, a A release film is interposed between the objects to be proces...

Claims

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Application Information

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IPC IPC(8): B32B27/30B32B27/00
CPCB32B27/30B32B27/00B32B7/06B32B27/08B32B27/302B32B27/308B32B27/32B32B2250/24B32B2307/51B32B2307/54B32B2307/748B32B2457/08C09J7/405C09J2301/312C09J2423/006C09J2425/005C09J2425/006
Inventor 谷口裕人
Owner SUMITOMO BAKELITE CO LTD
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