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Telecentric measurement method for lithography machine lens

A measurement method and technology of lithography machine, which can be applied in microlithography exposure equipment, testing optical performance, photolithography process exposure device, etc., can solve the problem that the relative telecentricity cannot be measured, and the spatial position relationship between the mirror group unit frames cannot be measured. equivalence

Active Publication Date: 2016-09-28
SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

This method has the following problems: first, the spatial positional relationship between the mirror group unit frames cannot be equated with the telecentric problem; second, the relative telecentric problem of the single objective lens in each mirror group unit frame cannot be measured

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  • Telecentric measurement method for lithography machine lens
  • Telecentric measurement method for lithography machine lens
  • Telecentric measurement method for lithography machine lens

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Embodiment Construction

[0031] Specific embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0032] The object of the present invention is to provide a telecentricity measurement and correction for a multi-lens lithography machine. There are two main factors that cause the telecentricity problem of multi-lens lithography machines: one is the position deviation of each single objective lens in the direction of the optical axis caused by limited mechanical installation accuracy, and the other is the difference between the single illumination system and the corresponding single objective lens caused by limited mechanical installation accuracy. positional deviation between.

[0033] In order to describe the multi-lens lithography machine telecentric measurement device and method provided by the present invention in detail, five spliced ​​lenses will be used as an illustration in the following implementation manner. Those skilled in the ar...

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Abstract

The invention discloses a telecentric measurement apparatus and a telecentric measurement method used in a lens in a lithography machine. The telecentric measurement apparatus includes: an optical scattering device used for scattering an exitance light from a lighting device of the lithography machine to form a scattered light which is scattered uniformly at each angle; a pinhole marker which is located in an object space view field of the lens; and an energy sensor used for measuring a central position of imaging of the pinhole marker. The invention also discloses a telecentric measurement method of the telecentric measurement apparatus used in the lens in the lithography machine.

Description

technical field [0001] The invention relates to the field of integrated circuit equipment manufacturing, in particular to a telecentric measurement device and method for at least one lens lithography machine. Background technique [0002] Multi-lens lithography machines are used in the manufacturing process of high-generation TFT displays and OLED displays. Large substrates and high productivity require a corresponding increase in the exposure field of view. It is difficult for a single objective lens to maintain or improve the imaging quality while increasing the field of view. The field of view splicing by multiple objective lenses with small field of view is a way to achieve a large field of view. The total objective lens spliced ​​by multiple single objective lenses can be called spliced ​​objective lens. The telecentricity problem of a single objective lens is determined by the illumination and the imaging performance of the objective lens itself, and the cause of the...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/20G01M11/02
Inventor 束奇伟葛亮
Owner SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD