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A dispensing and curing mechanism for assembling small parts of electronic products

A technology for electronic products and small parts, applied in the field of glue dispensing and curing mechanism and equipment, can solve the problems of small size, low production efficiency and inaccurate positioning of small parts, and achieve the effect of improving production efficiency, convenient operation and improving product quality

Active Publication Date: 2016-09-07
BOZHON PRECISION IND TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the small size of small parts, positioning is relatively difficult, which is easy to cause worker fatigue, resulting in long production time and low production efficiency, and the small parts assembled on the product are prone to looseness, inaccurate positioning and other quality problems

Method used

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  • A dispensing and curing mechanism for assembling small parts of electronic products
  • A dispensing and curing mechanism for assembling small parts of electronic products
  • A dispensing and curing mechanism for assembling small parts of electronic products

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Embodiment Construction

[0034] Examples, see attached Figure 1-12 , a dispensing and curing mechanism for assembling small parts of electronic products, which includes a base 1, a Y-axis mechanism I is installed on the base, and an X-axis mechanism II is connected to the Y-axis mechanism through an XY connecting plate 2. The X-axis mechanism is connected with the XZ connecting block a3, the XZ connecting block a is connected with the XZ connecting block b4, the XZ connecting block b is connected with the Z-axis linear module slider of the Z-axis mechanism III, and the Z-axis mechanism The back of the Z-axis linear module is connected to the ZR connecting plate 5, and the side of the Z-axis linear module is connected to the side fixing plate 6; the front part of the Z-axis mechanism is equipped with an R-axis mechanism IV through the ZR connecting plate; the R The front part of the shaft mechanism is equipped with a CCD mechanism V; the right side of the side fixing plate is equipped with a dispensin...

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Abstract

The invention relates to a dispensing curing mechanism for assembling small components of an electronic product. A Y-axis mechanism is installed on a base; an X-axis mechanism is installed on the Y-axis mechanism through an XY connecting plate; a Z-axis mechanism is installed on the X-axis mechanism through an XZ connecting block a and an XZ connecting block b; an R-axis mechanism is installed at the front part of the Z-axis mechanism through a ZR connecting plate; a CCD mechanism is installed at the front part of the R-axis mechanism; a dispensing laser mechanism is installed on the right side of the R-axis mechanism through a laser fixed plate; the R-axis mechanism is transported to an operation position by the X-axis, Y-axis and Z-axis mechanisms; the CCD mechanism moves to a material tray to take a photo, the position of the component is precisely positioned, and a clamping claw moves to a component clamping position to clamp the component; the CCD mechanism moves to a product to take a photo, and a dispensing position is determined; laser moves to the dispensing position on the product to measure the dispensing height; a dispensing valve moves to the dispensing position to dispense glue; finally the clamping claw moves to the dispensing position to be fit to the component and to cure the component by virtue of UV. By adopting the dispensing curing mechanism, precision for assembling the components of the electronic product can be realized, and convenience in operation can be realized.

Description

Technical field: [0001] The invention relates to the field of glue dispensing and curing mechanism equipment, in particular to a glue dispensing and curing mechanism for assembling small parts of electronic products. Background technique: [0002] In the production process of electronic products, some small parts need to be assembled on the electronic products. In some small factories, it is all done manually. Due to the small size of small parts, positioning is relatively difficult, and it is easy to cause worker fatigue, resulting in long production time and low production efficiency, and the small parts assembled on the product are prone to looseness, inaccurate positioning and other quality problems. At this time, a dispensing and laminating curing mechanism that can accurately assemble small parts to electronic products is needed, which can save manpower, improve production efficiency, and reduce the company's production costs. Invention content: [0003] The object...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B05C5/00B05D3/06
Inventor 吕绍林汪炉生朱晓锋叶友乐聂星李星
Owner BOZHON PRECISION IND TECH CO LTD
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