A spherical copper-coated tungsten composite powder, its preparation method and its use
A composite powder and copper-coated technology, applied in the field of copper-tungsten composite powder, spherical copper-coated tungsten composite powder, and preparation, can solve the problems of poor composition uniformity, complex process, cumbersome steps, etc.
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Embodiment 1
[0095] Example 1: Intermittent electroplating of copper-coated tungsten composite powder with pyrophosphate bath
[0096] (1) Common tungsten powder with an average particle size of 5-20 μm (such as figure 1 As shown) is spheroidized by radio frequency plasma spheroidization device, the main process parameters are: central gas (argon) flow rate 20-30L / min, side gas (argon gas) flow rate 90-120L / min, carrier gas (argon gas) The flow rate is 3.5L / min, the feeding rate is 5-10g / min, the reaction chamber pressure is 60-80KPa, and the operating power is 60-70KW. (2) the tungsten powder (such as figure 2 with image 3 shown) into the pyrophosphate copper plating solution, wherein the plating solution includes: copper pyrophosphate 60g / L, potassium pyrophosphate 320g / L, triammonium citrate 15g / L, potassium sodium tartrate 20g / L, ammonia water 3ml / L. Use citric acid and potassium hydroxide to adjust the pH value of the pyrophosphate copper plating solution to 8.3 to 8.5, and adj...
Embodiment 2
[0097] Example 2: Intermittent electroplating of copper-coated tungsten composite powder with pyrophosphate bath
[0098] (1) Ordinary tungsten powder with an average particle size of 1-10 μm is spheroidized by a radio frequency plasma spheroidization device. The main process parameters are: central gas (argon) flow rate 25-35L / min, edge gas (argon) The flow rate is 120-140L / min, the carrier gas (argon) flow rate is 4.5L / min, the feeding rate is 10-25g / min, the reaction chamber pressure is 90-100KPa, and the operating power is 40-60KW. (2) Join the tungsten powder processed through spheroidization in step (1) in the pyrophosphate copper plating bath, wherein the plating bath includes: copper pyrophosphate 60g / L, potassium pyrophosphate 320g / L, ammonium citrate 25g / L, ammonia water 3ml / L. Potassium hydroxide is used to adjust the pH value of the pyrophosphate copper plating solution to 8.5 to 8.8, and the temperature of the pyrophosphate copper plating solution is adjusted to...
Embodiment 3
[0099] Example 3: Intermittent electroplating of copper-coated tungsten composite powder with pyrophosphate bath
[0100] (1) Ordinary tungsten powder with an average particle size of 5-15 μm is spheroidized by a radio frequency plasma spheroidization device. The main process parameters are: central gas (argon) flow rate 20-30L / min, edge gas (argon) The flow rate is 90-120L / min, the carrier gas (argon) flow rate is 5L / min, the feeding rate is 5-10g / min, the reaction chamber pressure is 50-70KPa, and the operating power is 30-60KW. (2) Add the tungsten powder treated by spheroidization in the step (1) to the pyrophosphate copper plating bath, wherein the plating bath includes: copper pyrophosphate 60g / L, potassium pyrophosphate 320g / L, ammonium citrate 15g / L, potassium sodium tartrate 20g / L, ammonia water 2ml / L. Use citric acid and potassium hydroxide to adjust the pH value of the pyrophosphate copper plating solution to 8.0 to 8.4, and adjust the temperature of the pyrophosp...
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