Submersible liquid-cooling server and submersible liquid cooling method for server

A server and immersion technology, applied in instruments, electronic digital data processing, digital data processing components, etc., can solve the problems of energy loss, refrigerant tank pressure rise, refrigerant vapor cannot be cooled in time, etc., to achieve enhanced condensation exchange hot effect

Active Publication Date: 2015-04-29
SUGON DATAENERGYBEIJING CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, because the cooling capacity of each part of the cooling element is different, and as the heat emitted by the heating element increases, the cooling capacity of the cooling element is not enough to completely condense all the rising refrigerant vapor, and the refrigerant vapor passes through the cooling element. upward flow, which in turn causes energy to be lost in the server
In addition, the cooling capacity of the cooling element is insufficient, resulting in the failure to cool the refrigerant vapor in time, causing the temperature of the refrigerant to rise, and the pressure of the entire refrigerant tank also rises accordingly, unable to complete the refrigeration requirements.
In addition, leaking refrigerant vapor can increase the concentration of chemical reagents in the confined space, causing concern to users even though the refrigerant is not harmful to the environment and humans

Method used

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  • Submersible liquid-cooling server and submersible liquid cooling method for server

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Embodiment Construction

[0020] Specific embodiments of the present invention will be described below with reference to the accompanying drawings.

[0021] see figure 1 , an embodiment of the submerged liquid-cooled server of the present invention includes a refrigerant tank 2 , a heating element 3 disposed in the refrigerant tank 2 , and a cooling element 4 disposed in the refrigerant tank 2 . Wherein, the refrigerant tank 2 is used to accommodate the refrigerant 1 , the heating element 3 is submerged in the refrigerant 1 , and the cooling element 4 is located above the liquid surface of the refrigerant 1 .

[0022] In the submerged liquid-cooled server of this embodiment, the refrigerant 1 absorbs the heat of the heating element 3 and is evaporated and boiled into a refrigerant vapor, and the refrigerant vapor moves upwards, and exchanges heat with the cooling element 4 when it hits the cooling element 4, The refrigerant vapor condenses into refrigerant liquid droplets, and the refrigerant liquid d...

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Abstract

The invention relates to a submersible liquid-cooling server capable of preventing refrigerant steam leakage and a submersible liquid cooling method for the server. The server comprises a refrigerant tank, a heating element and a cooling element. The heating element is arranged in the refrigerant tank and is submerged by refrigerants. The cooling element is disposed above the liquid level of the refrigerants. Fans or air blowers are arranged above the cooling element, the direction of air flows blown out is parallel to the liquid level of the refrigerants to form an air curtain above the cooling element. The method for the server comprises that the refrigerants absorb heat of the heating element submerged in the refrigerants to evaporate the heat to form refrigerant steam which flows upwards; the cooling element performs heat exchange with the refrigerant steam flowing upwards, condensing the refrigerant steam into refrigerant liquid drops which drop back into the refrigerant tank due to the action of gravity; the air flows blown out by the fans or the air blowers are parallel to the liquid level of the refrigerants to form the air curtain above the cooling element.

Description

technical field [0001] The invention relates to an immersion liquid cooling server and an immersion liquid cooling method for the server. Background technique [0002] Most of the computers currently in use rely on cold air to cool down the machine, but in data centers, air cooling alone is not enough to meet the heat dissipation requirements of high heat flux density servers. Water cooling or liquid cooling has two advantages: it can direct the coolant to the heat source instead of indirect cooling like air cooling; compared with air cooling, the heat transfer efficiency per unit volume is as high as 3500 times. Water-cooled radiators appeared in the market around 2008. Servers such as Hewlett-Packard and IBM and other companies focusing on data center technology have successively launched water-cooled heat dissipation products. [0003] From the thermal principle, evaporative cooling uses the latent heat of vaporization when the refrigerant boils to remove heat. Since th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20
CPCG06F1/206G06F2200/201
Inventor 沈卫东范娟刘广辉吴宏杰崔新涛张卫平孟祥浩孙振王晨
Owner SUGON DATAENERGYBEIJING CO LTD
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