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Ceramic electronic component

A technology for electronic components and ceramics, applied in the field of ceramic electronic components, can solve the problems of cracks in the main body of capacitors, bad short circuits, etc., and achieve the effect of not easy to short circuit and hard to produce cracks

Active Publication Date: 2015-04-29
MURATA MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] However, even when the resin-containing electrode layer is formed as in Patent Document 1, cracks may occur on the capacitor body side before the stress received from the substrate is relieved by the resin-containing electrode layer.
In addition, for example, when the stress received from the substrate is not sufficiently absorbed in the resin-containing electrode layer, cracks may also occur from the edge of the base electrode layer to the capacitor body side.
If the crack reaches the effective layer of the internal electrode, it may cause a short circuit failure

Method used

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Examples

Experimental program
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Effect test

no. 1 Embodiment approach

[0031] (ceramic body)

[0032] figure 1 It is a schematic perspective view of a ceramic electronic component according to the present invention. figure 2 for figure 1 A schematic cross-sectional view of the part cut out by the line II-II in .

[0033] figure 1 as well as figure 2 The shown ceramic electronic component 1 may be a ceramic capacitor, or a piezoelectric component, a thermistor, or an inductor.

[0034] The ceramic electronic component 1 includes a cuboid ceramic body 10 . The ceramic body 10 has: first and second main faces 10a, 10b, first and second side faces 10c, 10d (refer to figure 1 ), and the first and second end faces 10e, 10f (refer to figure 2 ). The first and second main surfaces 10a, 10b extend along the longitudinal direction L and the width direction W. As shown in FIG. The first and second side surfaces 10c and 10d extend along the thickness direction T and the longitudinal direction L. As shown in FIG. The first and second end faces 10...

no. 2 Embodiment approach

[0098] image 3 It is a schematic cross-sectional view of a ceramic electronic component 1a according to the second embodiment.

[0099] image 3 The structure of the ceramic electronic part 1a shown is the same as figure 2 The difference in the structure of the ceramic electronic component 1 is that the first and second dummy electrodes 15 and 16 are provided in the ceramic body 10 .

[0100] The first dummy electrodes 15 are provided at approximately the same height as the first internal electrodes 11 and at intervals in the longitudinal direction. The second dummy electrodes 16 are provided at approximately the same height as the second internal electrodes 12 and at intervals in the longitudinal direction.

[0101] The first dummy electrodes 15 are drawn out to the second end surface 10f. The second dummy electrode 16 is drawn out to the first end surface 10e.

[0102] A

no. 3 Embodiment approach

[0104] Figure 4 It is a schematic cross-sectional view of a ceramic electronic component 1b according to the third embodiment.

[0105] Figure 4 The structure of the ceramic electronic part 1b is shown with figure 2 The difference in the structure of the ceramic electronic component 1 is that the first internal electrode 11a is drawn out to the first and second end faces 10e, 10f, and the second internal electrode 12a is drawn out to the first and second side faces 10c, 10d. Although not shown, external electrodes electrically connected to the second internal electrodes 12a are provided on the first and second side surfaces 10c and 10d, respectively. One of the pair of external electrodes and the first and second external electrodes 13 and 14 constitutes a signal terminal electrode, and the other constitutes a ground terminal electrode.

[0106] Also in the ceramic electronic component 1 b according to the present embodiment, A

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Abstract

The invention provides a ceramic electronic component less susceptible to producing cracks and short circuits in case of crack production. The distance between edge ends of a first end surface (10e) and the portion, located on a second main surface (10b), of a first firing electrode layer (13a) along the length direction is configured to be A. The distance between the first end surface (10e) and an effective area (a1) along the length direction is configured to be B. The distance between edge ends of the first end surface (10e) and of the portion, located on a second main surface (10b), of a first containing resin electrode layer (13b) along the length direction is configured to be C.

Description

technical field [0001] This invention relates to ceramic electronic components. Background technique [0002] Conventionally, laminated ceramic electronic components such as laminated ceramic capacitors have been used in various electronic devices. A multilayer ceramic capacitor generally has a ceramic body and first and second electrodes arranged in the ceramic body and facing each other with a ceramic portion interposed therebetween. [0003] In recent years, laminated ceramic electronic components have been used in harsher environments than before. For example, multilayer ceramic electronic components used in mobile devices such as cellular phones and portable music players are required to withstand shocks when dropped. Specifically, even if the multilayer ceramic electronic component receives an impact from being dropped, it is required that the multilayer ceramic electronic component does not come off from the mounting substrate and that cracks do not occur in the mul...

Claims

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Application Information

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IPC IPC(8): H01G4/30H01G4/232H01G4/12
CPCH01G4/005H01G4/1209H01G4/232H01G4/30
Inventor 胜田诚司
Owner MURATA MFG CO LTD
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