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High-speed line impedance continuity realization method

A realization method and continuous technology, applied in the direction of computer design circuit, electrical components, printed circuit manufacturing, etc., can solve the problems of products not working normally, and signal integrity cannot be determined and eliminated as early as possible, so as to reduce the impedance of high-speed signal lines. Continuous, easy to promote, simple design process effect

Inactive Publication Date: 2015-04-29
LANGCHAO ELECTRONIC INFORMATION IND CO LTD
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  • Abstract
  • Description
  • Claims
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Problems solved by technology

If signal integrity issues are not identified and eliminated early in the product design cycle, the product may not function properly

Method used

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  • High-speed line impedance continuity realization method
  • High-speed line impedance continuity realization method
  • High-speed line impedance continuity realization method

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Embodiment Construction

[0018] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.

[0019] The present invention proposes a design method for realizing the continuity of high-speed line impedance. The salient features are: in the breakout area inside the BGA (due to the limited space under the BGA and at the pin end, the wiring in this area cannot be routed according to the normal line width and line spacing, and usually requires Make the line width thinner and the spacing smaller to meet the wiring requirements. This wiring area is called the breakout area). Due to the limited space, the wiring has to be thinner and the line spacing smaller, so that the impedance is discontinuous.

[0020] In order to solve the problem of impedance discontinuity caused by wiring in the breakout area, the present invention uses the surface of the wiring in the breakout area to achieve a standard signal impedance value by increasing or decreasin...

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Abstract

The invention discloses a high-speed line impedance continuity realization method. The method includes the specific realization steps: selecting a standard impedance value, and computing suitable breakout region routing according to a BGA (ball grid array), namely the space size of a ball grid array packaging region; computing impedance for the breakout region routing to determine suitable copper thickness so as to reach the standard impedance value, and increasing copper coverage on the breakout region routing surface to enlarge signal impedance so as to realize impedance continuity. Compared with the prior art, the high-speed line impedance continuity realization method has the advantages that the purpose of signal integrity is achieved by increasing or decreasing the routing copper thickness within a limited space, signal reflection caused by impedance discontinuity is avoided, signal quality is improved, practicality is high, and popularization is facilitated.

Description

technical field [0001] The invention relates to the technical field of PCB, in particular to a method for realizing high-speed line impedance continuity with strong practicability. Background technique [0002] As users have higher and higher requirements for server performance, not only the clock frequency is increasing day by day, but the signal integrity problem becomes more serious, and the time for designers to solve the signal integrity problem and design products is also shortened day by day. Since there is only one chance to bring a product to market, the product must be successful in its first version and be mass-produced. If signal integrity issues are not identified and eliminated early in the product design cycle, the product may not function properly. [0003] Among them, impedance is the core of the method to solve the signal integrity problem. Any sudden change in impedance will cause the reflection and distortion of the voltage signal, which is the main sour...

Claims

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Application Information

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IPC IPC(8): H05K3/00
CPCH05K3/0005
Inventor 王林李永翠
Owner LANGCHAO ELECTRONIC INFORMATION IND CO LTD
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