Quick evaluation method for plastic encapsulated integrated circuit reliability under marine environment condition

Abstract

The invention relates to a quick evaluation method for plastic encapsulated integrated circuit reliability under a marine environment condition. The quick evaluation method for the plastic encapsulated integrated circuit reliability under the marine environment condition includes that exerting voltage stress, temperature stress, water vapor and atmosphere pressure to a sample, carrying out internal defect inspection on the sample through X-radiography, testing the sample, and judging whether the sample meets production performance and function index requirements. The quick evaluation method for the plastic encapsulated integrated circuit reliability under the marine environment condition fastens the plastic encapsulating material wetting rate and the organic material performance degradation through exerting the high temperature, high pressure and high humidity to simulate the marine environment, and the marine environment condition evaluation test finishing time is shortened to 1 to 2 days from the original 2 months. The quick evaluation method for the plastic encapsulated integrated circuit reliability under the marine environment condition considers the degradation effects of humidity, temperature, pressure, offset electric stress and the like comprehensive environment stress factors to the plastic encapsulated integrated circuit, uses the high-magnification X-ray fluoroscopy to detect the internal defects of the encapsulating material, and enables the evaluation test completeness and precision to be greatly improved.

Description

technical field [0001] The invention relates to the field of reliability of integrated circuits, in particular to a method for rapidly evaluating the reliability of plastic-encapsulated integrated circuits under marine environment conditions. Background technique [0002] Foreign research and statistical reports show that in the proportion of integrated circuit product failures caused by environmental stress, salt spray accounts for 4%, dust accounts for 6%, vibration accounts for 28%, and temperature and humidity are as high as 60%. Therefore, the impact of temperature and humidity on integrated circuit products is particularly important. significantly. The marine environment is mainly a high-heat and high-humidity environment. This environment is very harsh for plastic-encapsulated integrated circuits. If the plastic-encapsulated integrated circuit is not well packaged, moisture will penetrate into the packaged chip along the gap between the plastic-encapsulated material a...

AI Technical Summary

Problems solved by technology

Existing high-temperature and high-humidity tests (such as: 40°C / 90%R.H., 85°C / 85%R.H., 60°C / 95%R.H.) are used to evaluate the reliability of integrated circuits under marine environmental conditions. It takes a long time, usually more than 1000 hours for assessment, and it is difficult to find some specific failures of plastic-encapsulated integrated circuits under high temperature and high humidity conditions

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