A rapid evaluation method for the reliability of plastic-encapsulated integrated circuits under marine environmental conditions

Abstract

The invention relates to a method for rapidly evaluating the reliability of plastic-encapsulated integrated circuits under marine environmental conditions. The method includes: applying voltage stress, temperature stress, water vapor, and atmospheric pressure to the sample, and photographing the sample by X-rays. Carry out internal defect inspection, test the sample, and judge whether it meets the requirements of product performance and functional indicators. The present invention speeds up the wet-through rate of the plastic packaging material and the degradation of the performance of the organic material by imposing high temperature, high pressure, and high humidity test conditions that simulate the marine environment, and shortens the marine environment condition evaluation test that originally took 2 months to only 1 ~2 days to complete. The invention considers the influence of comprehensive environmental stress factors such as humidity, temperature, pressure, and bias electric stress on the degradation of plastic-encapsulated integrated circuits, and uses high-magnification X-ray perspective to check the defects inside the packaging material, which greatly improves the integrity of the evaluation test. sex, accuracy.

Description

technical field [0001] The invention relates to the field of reliability of integrated circuits, in particular to a method for rapidly evaluating the reliability of plastic-encapsulated integrated circuits under marine environment conditions. Background technique [0002] Foreign research and statistical reports show that in the proportion of integrated circuit product failures caused by environmental stress, salt spray accounts for 4%, dust accounts for 6%, vibration accounts for 28%, and temperature and humidity are as high as 60%. Therefore, the impact of temperature and humidity on integrated circuit products is particularly important. significantly. The marine environment is mainly a high-heat and high-humidity environment. This environment is very harsh for plastic-encapsulated integrated circuits. If the plastic-encapsulated integrated circuit is not well packaged, moisture will penetrate into the packaged chip along the gap between the plastic-encapsulated material a...

AI Technical Summary

Problems solved by technology

Existing high-temperature and high-humidity tests (such as: 40°C / 90%R.H., 85°C / 85%R.H., 60°C / 95%R.H.) are used to evaluate the reliability of integrated circuits under marine environmental conditions. It takes a long time, usually more than 1000 hours for assessment, and it is difficult to find some specific failures of plastic-encapsulated integrated circuits under high temperature and high humidity conditions

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