Stripping and collecting equipment based on high-frequency vibration

Abstract

The invention discloses a high-frequency vibration based material stripping and collecting device. The material stripping and collecting device comprises a base, an operating platform located above the base, a fixing plate fixed to the operating platform, a material collecting device located under the operating platform and used for collecting striped components and parts and a high-frequency vibration device located above the fixing plate, wherein a support is fixed to the fixing plate and used for fixing components and parts to be striped. The high-frequency vibration based material stripping and collecting device can reduced strength and working strength of an operator, remarkably improves working efficiency and is simple in structure, high in automation degree and operating accuracy and capable of effectively avoiding damage of the components and parts and residual adhesive and meanwhile avoiding edge water material collection.

Description

technical field [0001] The invention relates to the technical field of stripping and collecting equipment, in particular to a high-frequency vibration-based stripping and gathering equipment for microelectronic components (such as finished products such as semiconductor QFN and SMD). Background technique [0002] At present, with the rapid development of the electronic components industry, the requirements for its production equipment are also constantly increasing. How to effectively reduce production costs, improve production efficiency, and reduce loss and yield in the production process has become a key issue in this field. For example, in the LED field, light-emitting transistors need to be packaged first, and the packaged transistors must be separated from the film before they can be used in subsequent production. The quality of the stripping effect directly affects the quality of the transistor. However, during the detachment process, it will cause quality problems su...

AI Technical Summary

Problems solved by technology

The quality of the stripping effect directly affects the quality of the transistor. However, during the detachment process, it will cause quality problems such as crystal damage and residual glue around the crystal. Therefore, stripping is a process that LED manufacturers are very concerned about.

[0003] At present, the mechanical stamping stripping method or manual stripping method is mainly used. This method has the disadvantages of uneven stripping and burrs around the components, which seriously affects the later use of components. At the same time, due to the small size of components , it is difficult to collect the peeled workpiece

This method also has the problems of high labor intensity and low efficiency of manual operation.

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