Flexible circuit board and manufacturing method thereof

Abstract

A method for manufacturing a flexible circuit board, comprising the steps of: providing a circuit core board, the circuit core board comprising a first insulating base material and conductive circuit patterns formed on both sides of the first insulating base material, the The first insulating substrate has a discontinuous glass fiber cloth layer and an insulating colloid, and the insulating colloid is integrally connected to the glass fiber cloth layer, and the insulating colloid does not correspond to the glass fiber cloth on the circuit core board. The area of ​​the layer forms a bending area; provide the first substrate, the first bonding sheet and sequentially stack and press the first substrate, the first bonding sheet and the circuit core board to obtain a multi-layer substrate; and remove the first The substrate and the part of the first adhesive sheet corresponding to the bending area form a flexible circuit board. The present invention also relates to a flexible circuit board manufactured by the above method.

Description

technical field [0001] The invention relates to a flexible circuit board, in particular to a flexible circuit board with glass cloth fiber as an inner core board and a manufacturing method thereof. Background technique [0002] At present, when making flexible circuit boards in the industry, flexible circuit boards are usually used directly in the design of the joint area of ​​the soft and hard board. However, although this design scheme can ensure the bending effect of the joint area of ​​the soft and hard board, it has produced The following problems: First, the material of the flexible circuit board is generally more expensive than the material of the rigid circuit board, and the cost is higher; secondly, the main body of the flexible circuit board is polyimide material, and the main body of the rigid circuit board is glass cloth. Two different materials Different properties will inevitably lead to different expansion and contraction ratios during the production process, ...

AI Technical Summary

Problems solved by technology

[0002] At present, when making flexible circuit boards in the industry, flexible circuit boards are usually used directly in the design of the joint area of ​​the soft and hard board. However, although this design scheme can ensure the bending effect of the joint area of ​​the soft and hard board, it has produced The following problems: First, the material of the flexible circuit board is generally more expensive than the material of the rigid circuit board, and the cost is higher; secondly, the main body of the flexible circuit board is polyimide material, and the main body of the rigid circuit board is glass cloth. Two different materials Different properties will inevitably lead to different expansion and contraction ratios during the production process, which is not easy to control. Not only that, because of the two materials with different properties, it is necessary to consider both the performance of the rigid circuit board and the balance during the production process. The performance of flexible circuit boards leads to poor yields in the production process. In order to solve this problem, the industry uses glass cloth fibers with good bending properties to replace flexible circuit boards.

[0003] Although the glass fiber cloth base material can replace some functions of the flexible circuit board, it still needs to prepare special glue and glass fiber cloth base material, the cost is still high, and the bending performance of the glass fiber itself is not ideal

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