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Process method for milling and contouring of single-sided solder mask on package substrate

A processing method and technology for packaging substrates, which are applied in electrical components, printed circuit manufacturing, printed circuits, etc., and can solve the problems of short life, high price of left-handed milling cutters, and increased production costs.

Active Publication Date: 2017-11-03
GUANGZHOU FASTPRINT CIRCUIT TECH +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Therefore, the industry generally chooses left-handed milling cutters for processing products of this design, but left-handed milling cutters are generally expensive and short in life, and because the chip removal direction is downward, it is often necessary to pre-mill grooves on the backing plate , which will greatly increase the production cost

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  • Process method for milling and contouring of single-sided solder mask on package substrate
  • Process method for milling and contouring of single-sided solder mask on package substrate
  • Process method for milling and contouring of single-sided solder mask on package substrate

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Embodiment Construction

[0018] The method for processing the milling shape of a single-side solder mask of a packaging substrate according to the present invention will be further described in detail below mainly in conjunction with the accompanying drawings and specific embodiments.

[0019] Such as figure 1 As shown, a method for milling the shape of a single-sided solder mask on a packaging substrate in an embodiment is used for milling a single-sided solder mask, including the following steps:

[0020] Step 1: Making an outline file 10 of the single-sided solder mask of the packaging substrate, and mirroring the outline file 10 .

[0021] One side of the single-sided solder mask of the package substrate is a solder mask surface, and the other side is a smooth surface without solder mask coverage. After the outline file 10 of the single-sided solder resist board produced by CAM is completed, the original file needs to be horizontally mirrored and flipped, so that during subsequent processing, the...

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Abstract

Disclosed is a mill shaping processing method for single faced solder resistance plate of an encapsulation substrate, which firstly performs a windowing processing on a cover plate (100) so as to form a window structure (110) which is consistent with the size and the position of a milling groove to be formed by a single faced solder resistance plate (200) to be processed; places the single faced solder resistance plate (200) to be processed on a base plate (300), with the solder resistance face being upwards, and covers the cover plate (100), provided with a window structure (110), on the solder resistance face; and uses a right-hand milling cutter to perform a milling groove processing on the single faced solder resistance plate (200) to be processed.

Description

technical field [0001] The invention relates to the field of circuit board production, in particular to a method for milling and processing the shape of a single-sided solder resist plate of a packaging substrate. Background technique [0002] Compared with PCB soldering electrical components on the mother board, the packaging substrate needs to package the chip on the product. If the surface and edge quality of the packaging substrate are poor, it will seriously affect the packaging effect, resulting in glue overflow or poor reliability. Therefore, after milling the shape The product board surface quality and board edge quality requirements are high. For single-sided solder mask products, since one side is not covered by solder mask, the substrate is easily damaged during the milling process with a conventional right-handed milling cutter, and it is difficult for the dust to adhere to the board surface after high-temperature melting It is removed by washing with water, res...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00
CPCH05K3/00
Inventor 卢汝烽梁汉洙谢添华
Owner GUANGZHOU FASTPRINT CIRCUIT TECH