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Cabinet

A technology of cabinets and spoilers, which is applied in the modification of standard racks/cabinets, components of cabinets/cabinets/drawers, cooling/ventilation/heating transformation, etc., which can solve the problems of fan power consumption and operating costs Increased flow resistance and other issues to achieve the effect of increasing heat transfer capacity and improving heat dissipation efficiency

Active Publication Date: 2015-05-06
HUAWEI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, this kind of cabinet increases the heat dissipation area by encrypting the pleated board, and at the same time, its flow resistance also increases rapidly, resulting in the increase of fan power consumption and operating costs.

Method used

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Embodiment Construction

[0029] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0030] see figure 1 and figure 2 The first embodiment of the present invention provides a cabinet 10, at least one side of the cabinet 10 is provided with an inner wall 11 and an outer wall 13, and a cavity is formed between the inner wall 11 and the outer wall 13.

[0031] The cabinet 10 is further provided with a heat conduction plate 15 , the heat conduction plate 15 is disposed between the inner wall 11 and the outer wall 13 , and divides the cavity into an i...

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Abstract

The invention provides a cabinet. The cabinet is provided with an inner wall and an outer wall, wherein the inner wall and the outer wall form a cavity. The cabinet is further provided with a heat conducting plate, wherein the heat conducting plate is arranged between the inner wall and the outer wall, the cavity is divided into an inner cavity and an outer cavity which are isolated mutually, the inner cavity is mutually communicated with the inside of the cabinet so as to form internally circulating air flows, and the outer cavity is mutually communicated with the outside of the cabinet so as to form externally circulating air flows. The cabinet is further provided with turbulent flow fins, wherein the turbulent flow fins are arranged in the inner cavity or / and the outer cavity and used for changing the internally circulating air flows or / and externally circulating air flows into eddy flows. The cabinet is provided with the heat conducting plate and the turbulent flow fins, so that the heat exchange capacity of the heat conducting plate is remarkably improved under the condition that flowing resistance of the air flows is only increased within a narrow range, the heat dissipation efficiency of the whole cabinet is improved, and sealing performance of the cabinet is ensured.

Description

technical field [0001] The invention relates to the technical field of heat dissipation, in particular to a cabinet. Background technique [0002] In order to ensure that the electronic equipment installed in the cabinet can work normally and reliably under the allowable temperature condition, the cabinet in the prior art is usually equipped with a heat dissipation structure to provide good heat dissipation for the cabinet. [0003] Such as figure 1 As shown, there is an existing cabinet with an inner wall and an outer wall; a heat conduction plate is provided between the inner wall and the outer wall, and the heat conduction plate is a corrugated plate continuously and alternately provided with grooves and protrusions, and the heat conduction plate Isolate the space between the inner wall and the outer wall; wherein, the space between the outer wall and the heat conduction plate communicates with the outside world and can cooperate with a fan or other flow guiding device t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K5/02H05K7/20
CPCH05K7/20F28F13/12H05K7/206
Inventor 唐文飞伏永祥
Owner HUAWEI TECH CO LTD
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