High-precision leveling process on the ground of structural buildings
A high-precision technology for floor and floor, applied in the field of high-precision leveling technology for structural floor and floor, can solve the problems of high cost, low efficiency, complex process, etc., and achieve the effect of ensuring thickness, simplifying leveling process, and improving leveling operation efficiency.
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[0029] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.
[0030] Such as figure 1 As shown, it is a schematic diagram of an embodiment of the high-precision leveling process for the structure floor of the present invention, which can be applied to the pouring of the floor of the building structure without a leveling layer. The method includes the following steps:
[0031] Step S11: Fixing a plurality of punching pieces whose height matches the thickness of the concrete layer (floor floor of the building structure to be poured) to the formwork. The above-mentioned bead punching parts are made of engineering plastics and have a horizontal top surface, and...
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