Melt-and-play glue melting device

Abstract

The invention provides a melt-and-play glue melting device which comprises a glue cylinder, a glue injection gun nozzle, wherein the glue cylinder is used for storing a liquid glue stock; the glue injection gun nozzle is used for jetting the liquid glue stock; the conveying pipe is connected with the glue cylinder; and a screw rod is arranged in the conveying pipe, and rotates to melt a solid glue stock into the liquid glue stock. The melt-and-play glue melting device has the advantages that the boot waiting time can be shortened; the carbonization of the glue stock is removed; and the obtained glue is free of a bubble.

Description

technical field [0001] The invention relates to the field of low-pressure injection molding, in particular to an instant melt glue device. Background technique [0002] The heating method of the existing low-pressure glue injection melting machine is to heat the heat pipe installed at the bottom of the glue tank, and conduct the temperature heated at the bottom of the glue tank to the melt tank through the heating grid and the glue tank barrel, and heat the already heated glue tank through heat conduction. The hot melt adhesive raw material placed in the glue tank is heated and melted. [0003] The current melt glue tank has a long melting time, and the temperature distribution of the liquid glue after melting is uneven. The waiting time before production is too long due to the long melting time, which seriously affects the production efficiency; at the same time, the defective rate of the injection products increases due to the uneven temperature distribution of the melted...

AI Technical Summary

Problems solved by technology

[0003] The current melt glue tank has a long melting time, and the temperature distribution of the liquid glue after melting is uneven.

The waiting time before production is too long due to the long melting time, which seriously affects the production efficiency; at the same time, the defective rate of injection products increases due to the uneven temperature distribution of the melted glue

What's more serious is that the raw materials placed in the melt glue tank are heated repeatedly for a long time, which can easily cause the carbonization of the glue, which not only blocks the glue channel of the machine, but also seriously affects the quality of the encapsulated product.

At the same time, because of the open heating method, the air bubbles enter the melted liquid glue, causing many air bubbles to be wrapped in the encapsulated product, which not only causes the electrical properties of the product to fail to meet the requirements, but also causes the air bubbles in the encapsulated product to When the working environment temperature changes greatly, the solder pins of the electronic components soldered on the circuit board may be "pull apart" due to the shrinkage or expansion of the air bubbles.

Images