Radiator assembly technology for power semiconductor device

A power semiconductor and assembly process technology, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve problems such as affecting efficiency, long maintenance cycle, deformation, etc., to achieve convenient storage and transportation, easy installation and maintenance, and improve efficiency. Effect

Inactive Publication Date: 2015-05-27
SINENG ELECTRIC CO LTD
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  • Abstract
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Problems solved by technology

This kind of assembly process has the following disadvantages: 1. Every time a single board is produced, it needs to be installed and disassembled once on the tooling, which affects the efficiency; 2. After the IGBT is welded on the single board, it cannot be completely fixed, and it is easily deformed by external forces, which affects heat dissipation. The crimping quality of the device; 3. During product maintenance, the single board replacement process is complicated and the maintenance cycle is long

Method used

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  • Radiator assembly technology for power semiconductor device

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Embodiment Construction

[0015] The present invention will be further described below in conjunction with drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, but not to limit the present invention. In addition, it should be noted that, for the convenience of description, only some parts related to the present invention are shown in the accompanying drawings but not the whole content. Unless otherwise defined, all technical and scientific terms used herein are related to the technical field of the present invention. The skilled person generally understands the same meaning. The terms used herein are for describing specific embodiments only, and are not intended to limit the present invention.

[0016] The radiator assembly process of the power semiconductor device in this embodiment specifically includes: S1. Fixing the power semiconductor device on the heat-conducting substrate. S2, crimping the single board a...

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Abstract

The invention discloses a radiator assembly technology for a power semiconductor device. According to the technology, firstly, the power semiconductor device is fixed on a heat-conducting substrate, and then a single plate and the heat-conducting substrate with the power semiconductor device fixed are press-welded on a radiator as a whole. The problem that modular production of the power single plate cannot be realized is solved, simple and convenient mounting and maintenance of the single plate are realized, the special application condition of photovoltaic power generation is considered, on one hand, the efficiency of production and machining links can be improved, and on the other hand, storage and transportation of maintenance spare parts as well as quick maintenance and replacement on operation sites can be facilitated. Therefore, the technology is applicable to other fields which have large equipment scales and wide distribution ranges and require quick maintenance besides the photovoltaic power generation field.

Description

technical field [0001] The invention relates to the field of power semiconductor devices, in particular to a radiator assembly process for power semiconductor devices. Background technique [0002] The operating temperature of power semiconductor devices directly affects its electrical performance. There are three general heat dissipation methods: natural air cooling, forced air cooling, and water cooling. However, no matter what kind of heat dissipation method, the power device and the heat dissipation surface are basically coated with thermal conductive silicone grease, and then crimped together. This installation method solves the heat dissipation requirements of most products. However, as the power density of products becomes higher and higher, the assembly process of products becomes more and more complicated. In order to adapt to the design of the overall structure, the shape of the radiator is also various, increasing The production difficulty of the veneer is reduce...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/48H01L21/50
Inventor 鹿明星罗劼蔡海军
Owner SINENG ELECTRIC CO LTD
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