Radiator assembly technology for power semiconductor device

Abstract

The invention discloses a radiator assembly technology for a power semiconductor device. According to the technology, firstly, the power semiconductor device is fixed on a heat-conducting substrate, and then a single plate and the heat-conducting substrate with the power semiconductor device fixed are press-welded on a radiator as a whole. The problem that modular production of the power single plate cannot be realized is solved, simple and convenient mounting and maintenance of the single plate are realized, the special application condition of photovoltaic power generation is considered, on one hand, the efficiency of production and machining links can be improved, and on the other hand, storage and transportation of maintenance spare parts as well as quick maintenance and replacement on operation sites can be facilitated. Therefore, the technology is applicable to other fields which have large equipment scales and wide distribution ranges and require quick maintenance besides the photovoltaic power generation field.

Description

technical field [0001] The invention relates to the field of power semiconductor devices, in particular to a radiator assembly process for power semiconductor devices. Background technique [0002] The operating temperature of power semiconductor devices directly affects its electrical performance. There are three general heat dissipation methods: natural air cooling, forced air cooling, and water cooling. However, no matter what kind of heat dissipation method, the power device and the heat dissipation surface are basically coated with thermal conductive silicone grease, and then crimped together. This installation method solves the heat dissipation requirements of most products. However, as the power density of products becomes higher and higher, the assembly process of products becomes more and more complicated. In order to adapt to the design of the overall structure, the shape of the radiator is also various, increasing The production difficulty of the veneer is reduce...

AI Technical Summary

Problems solved by technology

This kind of assembly process has the following disadvantages: 1. Every time a single board is produced, it needs to be installed and disassembled once on the tooling, which affects the efficiency; 2. After the IGBT is welded on the single board, it cannot be completely fixed, and it is easily deformed by external forces, which affects heat dissipation. The crimping quality of the device; 3. During product maintenance, the single board replacement process is complicated and the maintenance cycle is long

Images