Dust removing tool and dust removing method for cavity of IGBT module

Abstract

The invention discloses a dust removing tool for a cavity of an IGBT module. The dust removing tool comprises a base, a support plate and a limiting mechanism arranged on the support plate, wherein the IGBT module is arranged on the support plate in an inverted manner, a through hole is formed in the support plate, an air blowing pipe is arranged below the base, and a hole is formed in a position, corresponding to the through hole, of the base; a support rod is arranged between the base and the support plate, and the support rod is used for supporting the support plate to be arranged in the inclined manner. The IGBT module is arranged on the support plate in the inverted manner, an air flow can enter the cavity of the IGBT module through the through hole in the lower part to clean the inner part of the cavity of the IGBT module, the dust removing tool is convenient to operate, and the air blowing pipe is moved back and forth, so that each corner in the cavity of the module is cleaned; the support rod is arranged to support the support plate, the dust removing tool is convenient for staff to operate and observe the cleaning condition, the cleaning efficiency and the cleaning effect are improved, the problems of impact damage or man-made damage and the like to organization structures on the module and the surface of the support plate are solved, and the manufacturing cost and the encapsulating cost are effectively reduced.

Description

technical field [0001] The invention belongs to the technical field of IGBT module manufacturing and packaging, and in particular relates to a dust removal tool for an IGBT module cavity and a dust removal method Background technique [0002] IGBT (Insulated Gate Bipolar Transistor), with high frequency, high voltage, high current, especially easy to turn on and off, is the most representative product of the third revolution of power electronics technology recognized internationally. It has been developed to the sixth generation so far, and commercialization has been developed to the fifth generation. At present, IGBT has been widely used in various industries of the national economy. [0003] After the IGBT module is manufactured, it needs to be packaged. On the one hand, the package of the module isolates the module from the outside world, so as to prevent the impurities in the air from corroding the chip circuit and causing the electrical performance to decline. On the ...

AI Technical Summary

Problems solved by technology

[0005] The traditional cavity cleaning method is mainly to hold a nitrogen gun with the other hand and hold the module with the other hand to clean the cavity before installing the top cover. This cleaning method is inconvenient to operate, time-consuming and laborious, and the cleaning efficiency is low; Improper strength can easily cause damage to the module shell and increase packaging costs; and cleaning the module cavity by holding the module by hand cannot guarantee the uniformity and comprehensiveness of the cleaning, and the cleaning effect is poor

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