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A kind of vinyl phenyl silicone resin containing epoxy group in side chain and preparation method thereof

A vinyl phenyl silicon and epoxy group technology, applied in the direction of adhesives, etc., can solve the problems of poor adhesion and poor mechanical properties, and achieve the effects of high transparency, convenient operation and good mechanical strength

Inactive Publication Date: 2017-11-03
SHANGHAI INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] Aiming at the above-mentioned technical problems in the prior art, the present invention provides a vinyl phenyl silicone resin containing epoxy groups in the side chain and a preparation method thereof, the vinyl phenyl silicone resin containing epoxy groups in the side chain Phenyl silicone resin and preparation method thereof solve technical problems such as poor adhesion and poor mechanical properties of silicone resin in the prior art

Method used

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  • A kind of vinyl phenyl silicone resin containing epoxy group in side chain and preparation method thereof
  • A kind of vinyl phenyl silicone resin containing epoxy group in side chain and preparation method thereof
  • A kind of vinyl phenyl silicone resin containing epoxy group in side chain and preparation method thereof

Examples

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Embodiment 1

[0032] A kind of preparation method of the vinyl phenyl silicone resin that side chain contains epoxy group, specifically comprises the steps:

[0033] (1) Preparation of cyclotetrasiloxane containing epoxy cyclohexane group

[0034] Under a nitrogen atmosphere, 100 parts by weight of 1,3,5,7-tetramethylcyclotetrasiloxane and 206 parts by weight of 4-vinyl epoxycyclohexane were added in proportion to the In a 500ml four-necked flask with a funnel and a thermometer, add 100 parts by weight of toluene, 0.001 parts by weight of chloroplatinic acid-isopropanol solution, and simultaneously add 0.001 parts by weight of 4-methoxyphenol; then heat up to 80°C and react for 2 hours. The reaction mixture was distilled under reduced pressure at -0.096MPa at 150°C to remove the solvent and residual low boilers to obtain a liquid with a viscosity of 3000mPa.s, namely cyclotetrasiloxane containing epoxycyclohexane groups.

[0035] The cyclotetrasiloxane containing epoxycyclohexane group of ...

Embodiment 2

[0047] A kind of preparation method of the vinyl phenyl silicone resin that side chain contains epoxy group, specifically comprises the steps:

[0048] (1) Preparation of cyclotetrasiloxane containing epoxy cyclohexane group

[0049] Under a nitrogen atmosphere, 100 parts by weight of 1,3,5,7-tetramethylcyclotetrasiloxane and 208 parts by weight of 4-vinyl epoxycyclohexane were added in proportion to the In a 500ml four-necked flask with a funnel and a thermometer, add 100 parts by weight of cyclohexane, 0.002 parts by weight of chloroplatinic acid, and 0.003 parts by weight of hydroquinone; then heat up to 85°C and react for 5 hours. Under reduced pressure at -0.096MPa, the solvent and residual low boilers were removed to obtain a light yellow liquid with a viscosity of 3600mPa.s, namely cyclotetrasiloxane containing epoxycyclohexane groups.

[0050] According to the national standard GB / T 1677-2008, the epoxy value of the plasticizer is determined to be 0.54; it is close to...

Embodiment 3

[0060] A kind of preparation method of the vinyl phenyl silicone resin that side chain contains epoxy group, specifically comprises the steps:

[0061] (1) Preparation of cyclotetrasiloxane containing epoxy cyclohexane group

[0062] Under a nitrogen atmosphere, 100 parts by weight of 1,3,5,7-tetramethylcyclotetrasiloxane and 210 parts by weight of 4-vinyl epoxycyclohexane were added in proportion to the In a 500ml four-necked flask with a funnel and a thermometer, add 100 parts by weight of cyclohexane, 0.003 parts by weight of chloroplatinic acid, and 0.003 parts by weight of hydroquinone; then heat up to 90°C and react for 10 hours. Under reduced pressure at -0.096MPa, the solvent and residual low boilers were removed to obtain a light yellow liquid with a viscosity of 4300mPa.s, namely cyclotetrasiloxane containing epoxycyclohexane groups.

[0063] According to the national standard GB / T 1677-2008, the epoxy value of the plasticizer is determined to be 0.54; it is close t...

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Abstract

The present invention is a vinyl phenyl silicone resin containing epoxy groups in the side chain. Its structural formula is as follows. The present invention also discloses the preparation method of the above-mentioned resin. In a nitrogen atmosphere, 1, 3, 5, 7-Tetramethylcyclotetrasiloxane and 4-vinyl epoxy cyclohexane are added into a reaction vessel, solvent, parts by weight of catalyst, and polymerization inhibitor by weight are added, followed by heating up and reacting under reduced pressure to obtain ring-containing Cyclotetrasiloxane with epoxycyclohexane group, and cyclotetrasiloxane with epoxycyclohexane group, vinyl cyclosiloxane, methylphenyl cyclosiloxane, capped The agent is added into another reaction vessel to raise the temperature to react, and the vinylphenyl silicone resin containing epoxy groups in the side chain is obtained through vacuum distillation. The method of the present invention is simple and flexible, has mild reaction conditions, and is suitable for industrial production.

Description

technical field [0001] The invention belongs to the field of polymer materials, and relates to a vinyl phenyl silicone resin, in particular to a vinyl phenyl silicone resin with epoxy groups in its side chain and a preparation method thereof. Background technique [0002] The rapid development of the LED packaging industry requires the development of packaging materials that are resistant to thermal shock, non-yellowing, high light transmittance, and high refractive index. At present, common LED packaging materials are mainly bisphenol A transparent epoxy resin and silicone resin. Epoxy resin is suitable for low-power LED packaging process. Silicone resin is suitable for the packaging of high-power LEDs. Silicone resin has the advantages of high light transmittance, good thermal stability, low stress, and low moisture absorption. However, silicone resin has poor adhesion to the chip as an encapsulant and poor mechanical properties. It is often used in silicone encapsulant....

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G77/20C08G77/06C09J183/07C09J183/06
Inventor 张英强赵永新徐耀民王晓瑞郑康生吴蓁
Owner SHANGHAI INST OF TECH
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